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Part Number: Geode™ GX1
Description: The National Semiconductor® Geode™ GX1 processor series is a line of integrated p...
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Geode™ GX1
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General Description
Geode™ GX1 General Description
The National Semiconductor® Geode™ GX1 processor series is a line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it's the perfect solution for IA (information appliance) applications such as thin clients, interactive set-top boxes, and personal internet access devices.
The Geode GX1 processor series is divided into three main categories as defined by the core operating voltage. Available with core voltages of 2.0V, 1.8V, and 1.6V, it offers extremely low typical power consumption (1.2W, 1.0W, and 0.8W, respectively) leading to longer battery life and enabling small form-factor, fanless designs. Typical power consumption is defined as an average, measured running Microsoft Windows at 80% Active Idle (Suspend-on-Halt) with a display resolution of 800x600x8 bpp at 75 Hz.
Geode™ GX1 Maximum Ratings
| Symbol | Parameter | Min | Max | Units | Comments |
| TCASE | Operating Case Temperature | 65 | 110 | °C | Power Applied |
| TSTORAGE | Storage Temperature | 65 | 150 | °C | NoBias |
| VCC2 | Core Supply Voltage | ||||
| 1.6V (Nominal) | 2.3 | V | |||
| 1.8V (Nominal) | 2.3 | V | |||
| 2.0V (Nominal) | 2.3 | V | |||
| VMAX | Voltage On Any Pin | 0.5 | 3.6 | V | |
| IIK | Input Clamp Current | 0.5 | 10 | mA | Power Applied |
| IOK | Output Clamp Current | 25 | mA | Power Applied | |
Table 6-3 lists absolute maximum ratings for the GX1 processor. Stresses beyond the listed ratings may cause permanent damage to the device. Exposure to conditions beyond these limits may (1) reduce device reliability and (2) result in premature failure even when there is no immediately apparent sign of failure. Prolonged exposure to conditions at or near the absolute maximum ratings may also result in reduced useful life and reliability. These are stress ratings only and do not imply that operation under any conditions other than those listed under Recommended Operating Conditions Table 6-4 on page 190 is possible.
Geode™ GX1 Features
Packaging:
- 352-Terminal Ball Grid Array (BGA) or
- 320-Pin Staggered Pin Grid Array (SPGA)
0.18-micron four layer metal CMOS process
Split rail design:
- Available 1.6V, 1.8V, or 2.0V core
- 3.3V I/O interface
Fully static design
Low Typical Power Consumption:
- 0.8W @ 1.6V/200 MHz
- 1.2W @ 2.0V/300 MHz
Speeds offered up to 300 MHz
Unified Memory Architecture
- Frame buffer and video memory reside in main memory
- Minimizes PCB (Printed Circuit Board) area requirements
- Reduces system cost
Compatible with multiple Geode I/O companion devices provided by National Semiconductor
- 352-Terminal Ball Grid Array (BGA) or
- 320-Pin Staggered Pin Grid Array (SPGA)
0.18-micron four layer metal CMOS process
Split rail design:
- Available 1.6V, 1.8V, or 2.0V core
- 3.3V I/O interface
Fully static design
Low Typical Power Consumption:
- 0.8W @ 1.6V/200 MHz
- 1.2W @ 2.0V/300 MHz
Speeds offered up to 300 MHz
Unified Memory Architecture
- Frame buffer and video memory reside in main memory
- Minimizes PCB (Printed Circuit Board) area requirements
- Reduces system cost
Compatible with multiple Geode I/O companion devices provided by National Semiconductor
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