MPLAB®-ICE

Attention to component placement should be considered in mating the adapter sockets to the SOIC/SSOP headers. If visual alignment is difficult in your application, c-shaped end brackets have been included to aid in header-to-adapter socket alignment.

Clip the brackets onto the SOIC/SSOP header.

The placement of via's around the Surface Mount Technology (SMT) layout area should be examined. Via's immediately adjacent to the end of a SMT pad may inadvertently come into contact with the header leads. Via's should be placed along the centerline of the SMT pad to lessen the chance of pin to pin shorts while soldering.

The SOIC Header is designed for SOIC body width of 0.300-inch, the adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths.