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1SS423, 1SS424, 1SS425

1SS423, 1SS424, 1SS425 Selling Leads, Datasheet

MFG:TOSHIBA  Package Cooled:822  D/C:SOT523

1SS423, 1SS424, 1SS425 Picture

1SS423, 1SS424, 1SS425 Datasheet download

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Part Number: 1SS423

 

MFG: TOSHIBA

Package Cooled: 822

D/C: SOT523

 

 

 
 
 
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About 1SS104

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Datasheet: 1SS104

File Size: 69893 KB

Manufacturer: TOSHIBA [Toshiba Semiconductor]

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About 1SS104

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Datasheet: 1SS104

File Size: 69893 KB

Manufacturer: TOSHIBA [Toshiba Semiconductor]

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About 1SS104

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Datasheet: 1SS104

File Size: 69893 KB

Manufacturer: TOSHIBA [Toshiba Semiconductor]

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1SS423 Maximum Ratings

Characteristic Symbol Rating Unit
Maximum (peak) reverse voltage VRM 45 V
Reverse voltage VR 40 V
Maximum (peak) forward current IFM 200* mA
Average forward current IO 100* mA
Power dissipation IFSM 1* A
Power dissipation P 100* mW
Junction temperature Tj 125
Storage temperature range Tstg −55~125
Operating temperature range Topr −40~100

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

1SS423 Typical Application

• Small package
• Low forward voltage: VF (3) = 0.56 V (typ.)
• Low reverse current: IR = 5 A (max)

1SS424 Maximum Ratings

Characteristic
Symbol
Rating
Unit
Maximum (peak) reverse voltage
VRM
30
V
Reverse voltage
VR
20
V
Maximum (peak) forward current
IFM
300
mA
Average forward current
IO
200
mA
Surge current (10 ms)
IFSM
1
A
Power dissipation
P *
150
mW
Junction temperature
Tj
125
Storage temperature range
Tstg
-55~125
Operating temperature range
Topr
-40~100


Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Mounted on a glass-epoxy circuit board of 20*20 mm,pad dimensions of 4*4 mm.

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