5337, 533722B02552G, 53375-0410 Selling Leads, Datasheet
MFG:K9F1G08U0A-PIB0 Package Cooled:SAMSUNG D/C:N/A
5337, 533722B02552G, 53375-0410 Datasheet download
Part Number: 5337
MFG: K9F1G08U0A-PIB0
Package Cooled: SAMSUNG
D/C: N/A
MFG:K9F1G08U0A-PIB0 Package Cooled:SAMSUNG D/C:N/A
5337, 533722B02552G, 53375-0410 Datasheet download
MFG: K9F1G08U0A-PIB0
Package Cooled: SAMSUNG
D/C: N/A
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PDF/DataSheet Download
Datasheet: 5330H1-5V
File Size: 75611 KB
Manufacturer: CML
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 5330H1-5V
File Size: 75611 KB
Manufacturer: CML
Download : Click here to Download
PDF/DataSheet Download
Datasheet: 5330H1-5V
File Size: 75611 KB
Manufacturer: CML
Download : Click here to Download
Thermal Resistance | 5.70 |
Part # | Description | Finish | Board Mounting |
533722B02552G | Extruded heat sink with large radial fins and solderable pins and device clip | Black Anodize | N/A |
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. |