BAP64-04W, BAP64-05, BAP64-05215 Selling Leads, Datasheet
MFG:NXP Package Cooled:2009 D/C:65264
BAP64-04W, BAP64-05, BAP64-05215 Datasheet download
Part Number: BAP64-04W
MFG: NXP
Package Cooled: 2009
D/C: 65264
MFG:NXP Package Cooled:2009 D/C:65264
BAP64-04W, BAP64-05, BAP64-05215 Datasheet download
MFG: NXP
Package Cooled: 2009
D/C: 65264
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PDF/DataSheet Download
Datasheet: BAP64-04W
File Size: 92272 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BAP64-05
File Size: 53563 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BAP1321-01
File Size: 77203 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
SYMBOL | PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
Per diode | |||||
VR | continuous reverse voltage |
- |
100 |
V | |
IF | continuous forward current |
- |
100 |
mA | |
Ptot | total power dissipation |
TS = 90 |
- |
250 |
mW |
Tstg | storage temperature |
-65 |
+150 |
||
Tj | junction temperature |
-65 |
+150 |
Parameter | Symbol | Min | Max | Unit |
continuous reverse voltage | VR | 175 | V | |
continuous forward current | IF | 100 | mA | |
total power dissipation Ts = 90 | Ptot | 200 | mW | |
storage temperature | Tstg | -65 | +150 | |
junction temperature | Tj | -65 | +150 | |
thermal resistance from junction to soldering point | Rth j-s | 220 | K/W |