BYG70D, BYG70G, BYG70J115 Selling Leads, Datasheet
MFG:Philips Package Cooled:SOD106 D/C:09+
BYG70D, BYG70G, BYG70J115 Datasheet download
Part Number: BYG70D
MFG: Philips
Package Cooled: SOD106
D/C: 09+
BYG70D, BYG70G, BYG70J115
- Table of contents:
Info of BYG70D
Info of BYG70G
Info of BYG70J115
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About BYG70D
PDF/DataSheet Download
Datasheet: BYG70D
File Size: 36752 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About BYG70G
PDF/DataSheet Download
Datasheet: BYG70G
File Size: 36752 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About BYG10
PDF/DataSheet Download
Datasheet: BYG10
File Size: 61353 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
BYG70D General Description
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
BYG70D Maximum Ratings
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VRRM | repetitive peak reverse voltage | 200 | V | ||
| VR | continuous reverse voltage | 200 | V | ||
| I F(AV) | average forward current | averaged over any 20 ms period; Ttp = 100 °C; see Fig.2 averaged over any 20 ms period; Al2O3 PCB mounting (see Fig.7); Tamb =60 °C; see Fig.3 averaged over any 20 ms period; epoxy PCB mounting (see Fig.7); Tamb =60 °C; see Fig.3 |
1.00 |
A | |
| IFSM | non-repetitive peak forward current | t = 10 ms half sinewave; Tj =Tj max prior to surge; VR =VRRMmax |
20 |
A |
| E RSM | non-repetitive peak reverse avalanche energy | L = 120 mH; Tj =Tj max prior to surge; inductive load switched off | 10 | mJ | |
| Tstg | storage temperature | -65 | +175 | ||
| Tj | operating junction temperature | -65 | +175 |
BYG70D Features
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* UL 94V-O classified plastic package
* Shipped in 12 mm embossed tape.
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* UL 94V-O classified plastic package
* Shipped in 12 mm embossed tape.
BYG70D Connection Diagram
BYG70G General Description
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
BYG70G Maximum Ratings
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VRRM | repetitive peak reverse voltage | 400 | V | ||
| VR | continuous reverse voltage | 400 | V | ||
| I F(AV) | average forward current | averaged over any 20 ms period; Ttp = 100 °C; see Fig.2 averaged over any 20 ms period; Al2O3 PCB mounting (see Fig.7); Tamb =60 °C; see Fig.3 averaged over any 20 ms period; epoxy PCB mounting (see Fig.7); Tamb =60 °C; see Fig.3 |
400 |
A | |
| IFSM | non-repetitive peak forward current | t = 10 ms half sinewave; Tj =Tj max prior to surge; VR =VRRMmax |
20 |
A |
| E RSM | non-repetitive peak reverse avalanche energy | L = 120 mH; Tj =Tj max prior to surge; inductive load switched off | 10 | mJ | |
| Tstg | storage temperature | -65 | +175 | ||
| Tj | operating junction temperature | -65 | +175 |
BYG70G Features
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* UL 94V-O classified plastic package
* Shipped in 12 mm embossed tape.
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* UL 94V-O classified plastic package
* Shipped in 12 mm embossed tape.
BYG70G Connection Diagram
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