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BYM11-400-E3/96, BYM11-50, BYM11-600-E3

Table of contents:
Info of BYM11-400-E3/96
Info of BYM11-50
Info of BYM11-600-E3

BYM11-400-E3/96, BYM11-50, BYM11-600-E3 Selling Leads, Datasheet

MFG:GENERAL SEMICONDUCTOR Package Cooled:DO-213AB D/C:09+

BYM11-400-E3/96, BYM11-50, BYM11-600-E3 Picture

BYM11-400-E3/96, BYM11-50, BYM11-600-E3 Datasheet download

Five Points

Part Number: BYM11-400-E3/96

MFG: GENERAL SEMICONDUCTOR

Package Cooled: DO-213AB

D/C: 09+

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BYM11-50 General Description

BYM11-50 thru BYM11-1000 datasheet

BYM11-50 Maximum Ratings

	SYMBOLS	RGL 41A	RGL 41B	RGL 41D	RGL 41G	RGL 41J	RGL 41K	RGL 41M	UNITS
Maximum repetitive peak reverse voltage	V_RRM	50	100	200	400	600	800	1000	V
Maximum RMS voltage	V_RSM	35	70	140	280	420	560	700	V
Maximum DC blocking voltage	V_DC	50	100	200	400	600	800	1000	V
Maximum average forward rectified current 10mm lead length at TA = 55°C	_F_(AV)	1.0							A
Peak forward surge current 10ms single half sine-wave superimposed on rated load (JEDEC Method)	I_FSM	30.							Am
Maximum instantaneous forward voltage at 1.0A	VF	1.3							mA
Maximum DC reverse current TA=25°C at rated DC blocking voltage TA=125°C	IR	5.0 50.0							mA
Maximum reverse recovery time (NOTE 1)	trr	150			250		500		ns
Typical junction capacitance (NOTE 2)	CJ	15.0							pF
Maximum thermal resistance (I=10mm)	R_JA R_JL	75.0 30.0							°C/W
Operating and storage temperature rang	T_JT_STG	65 to +175							°C

BYM11-50 Features

· Plastic package has Underwriters Laboratory Flammability Classification 94V-0
· Capable of meeting environmental standards of MIL-S-19500
· For surface mount applications
· High temperature metallurgically bonded construction
· Glass passivated cavity-free junction
· Fast switching for high efficiency
· High temperature soldering guaranteed: 450°C/5 seconds at terminals. Complete device submersible temperature of 260°C for 10 seconds in solder bath

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