CD74HC185E, CD74HC190, CD74HC190NS Selling Leads, Datasheet
MFG:HARRIS Package Cooled:95+ D/C:DIP-16
CD74HC185E, CD74HC190, CD74HC190NS Datasheet download

Part Number: CD74HC185E
MFG: HARRIS
Package Cooled: 95+
D/C: DIP-16
MFG:HARRIS Package Cooled:95+ D/C:DIP-16
CD74HC185E, CD74HC190, CD74HC190NS Datasheet download

MFG: HARRIS
Package Cooled: 95+
D/C: DIP-16
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Datasheet: CD7232CS
File Size: 342887 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: CD74HC190
File Size: 282624 KB
Manufacturer: TI
Download : Click here to Download
PDF/DataSheet Download
Datasheet: CD7232CS
File Size: 342887 KB
Manufacturer:
Download : Click here to Download
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . ±20 mA
Continuous output drain current per output, IO (VO = 0 to VCC) . . . . . .±35 mA
Continuous output source or sink current per output, IO (VO = 0 to VCC) . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, JA (see Note 2): E package . . . . . . . . . 67°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108°C/W
Storage temperature range, Tstg . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.

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