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` Operating Temperature: -55 to +150 ` Storage Temperature: -55 to +150 ` Typical Thermal Resistance: 20/W Junction to Ambient
EGP30K Features
· Superfast recovery time for high efficiency · Glass passivated cavity-free junction, Plastic case · Low forward voltage, high current capability · Low leakage current
EGP30M Maximum Ratings
Ratings at 25 ambient temperature unless otherwise specified.
SYMBOLS
EGP30
UNITS
A
B
D
F
G
J
K
M
Maximum repetitive peak reverse voltage
VRRM
50
100
200
300
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
35
70
140
210
280
420
560
700
Volts
Maximum DC blocking voltage
VDC
50
100
200
300
400
600
800
1000
Volts
Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55
I(AV)
3.0
Amps
Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method)
IFSM
125
115
Amps
Maximum instantaneous forward voltage at 1.0A
VF
1.0
1.25
1.7
Volts
Maximum DC reverse currentTA=25 at rated DC blocking voltageTA=125 TA=150
IR
5 50 120
5 120 -
A
Maximum reverse recovery time (NOTE 1)
trr
50
75
ns
Typical junction capacitance (NOTE 2)
CJ
75
pF
Typical thermal resistance (NOTE 3)
RJA RJL
20 8
/W
Operating junction and storage temperature range
TJ, TSTG
-65 to +175
-55 to +150
NOTES : (1) Reverse recovery test condition : IF 0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead lengths, P.C.B. mounted.
EGP30M Features
` GPRC (Glass Passivated Rectifier Chip) inside ` Glass passivated cavity-free junction ` Superfast recovery time for high efficiency ` Low forward voltage , high current capability ` Low leakage current ` High surge current capability ` High temperature soldering guaranteed: 260/10 seconds, 0.375" (9.5mm) lead length, 5lbs. (2.3 kg) tension ` Plastic package has Underwriters Laboratory Flammability Classification 94V-0