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EGP30K, EGP30M, EGP50

EGP30K, EGP30M, EGP50 Selling Leads, Datasheet

MFG:Fairchild Semiconductor  Category:Discrete Semiconductor Products  Package Cooled:N/A  D/C:09+

EGP30K, EGP30M, EGP50 Picture

EGP30K, EGP30M, EGP50 Datasheet download

Five Points

Part Number: EGP30K

Category: Discrete Semiconductor Products

MFG: Fairchild Semiconductor

Package Cooled: N/A

D/C: 09+

Description: DIODE FAST GPP 3A 800V DO-201AD

 

 
 
 
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EGP30K Suppliers

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  • EGP187M2GO25SZRA

  • Vendor: ManYue D/C: 06& Qty: 100 Note: New, Same-Day Ship, Tray(100ea), RoHS:Y  Adddate: 2024-05-05
  • Inquire Now
  • TechNut Electronics   United
    Contact: Mr.Josh  
    Tel: 0-801-529-8126
    Fax: 0-801-649-2705
    (14)

About EGP30K

PDF/DataSheet Download

Datasheet: EGP30K

File Size: 84855 KB

Manufacturer: MCC [Micro Commercial Components]

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EGP30M Suppliers

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  • EGP187M2GO25SZRA

  • Vendor: ManYue D/C: 06& Qty: 100 Note: New, Same-Day Ship, Tray(100ea), RoHS:Y  Adddate: 2024-05-05
  • Inquire Now
  • TechNut Electronics   United
    Contact: Mr.Josh  
    Tel: 0-801-529-8126
    Fax: 0-801-649-2705
    (14)

About EGP30M

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Datasheet: EGP30M

File Size: 64560 KB

Manufacturer: ZOWIE [Zowie Technology Corporation]

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EGP50 Suppliers

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  • EGP50D

  • Vendor: GS Pack: DIP D/C: 09+& Qty: 30000  Adddate: 2024-05-05
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  • LISSONY TECHNOLOGY LIMITED   China
    Contact: Ms.Enya   MSN:enyayuanyuan@hotmail.com
    Tel: 86-755-61329003
    Fax: 86-755-61329013
    (421)
  • EGP50D-E34

  • Vendor: GSI D/C: 01+&   Adddate: 2024-05-05
  • Inquire Now
  • orientelec   China
    Contact: Ms.Jessica Ren   MSN:jessica@orientelec.cn
    Tel: 86-10-62103873/62101821
    Fax: 86-10-62102720
    (5)
  • EGP187M2GO25SZRA

  • Vendor: ManYue D/C: 06& Qty: 100 Note: New, Same-Day Ship, Tray(100ea), RoHS:Y  Adddate: 2024-05-05
  • Inquire Now
  • TechNut Electronics   United
    Contact: Mr.Josh  
    Tel: 0-801-529-8126
    Fax: 0-801-649-2705
    (14)

About EGP50

PDF/DataSheet Download

Datasheet: EGP50

File Size: 60540 KB

Manufacturer: GE [General Semiconductor]

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EGP30K Parameters

Technical/Catalog InformationEGP30K
VendorFairchild Semiconductor
CategoryDiscrete Semiconductor Products
Diode Type Standard
Voltage - DC Reverse (Vr) (Max)800V
Current - Average Rectified (Io)3A
Voltage - Forward (Vf) (Max) @ If1.7V @ 3A
Reverse Recovery Time (trr)75ns
Current - Reverse Leakage @ Vr5A @ 800V
SpeedFast Recovery =< 500ns, > 200mA (Io)
Mounting TypeThrough Hole, Axial
Package / CaseDO-201AD, Axial
PackagingTape & Reel (TR)
Capacitance @ Vr, F-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names EGP30K
EGP30K

EGP30K Maximum Ratings

`  Operating Temperature: -55 to +150
`  Storage Temperature: -55 to +150
`  Typical Thermal Resistance: 20/W Junction to Ambient

EGP30K Features

·  Superfast recovery time for high efficiency
·  Glass passivated cavity-free junction, Plastic case
·  Low forward voltage, high current capability
·  Low leakage current

EGP30M Maximum Ratings

Ratings at 25 ambient temperature
unless otherwise specified.
SYMBOLS
EGP30
UNITS
A
B
D
F
G
J
K
M
Maximum repetitive peak reverse voltage
VRRM
50
100
200
300
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
35
70
140
210
280
420
560
700
Volts
Maximum DC blocking voltage
VDC
50
100
200
300
400
600
800
1000
Volts
Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=55
I(AV)
3.0
Amps
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
IFSM
125
115
Amps
Maximum instantaneous forward voltage at 1.0A
VF
1.0
1.25
1.7
Volts
Maximum DC reverse currentTA=25
at rated DC blocking voltageTA=125
TA=150
IR
5
50
120
5
120
-
A
Maximum reverse recovery time (NOTE 1)
trr
50
75
ns
Typical junction capacitance (NOTE 2)
CJ
75
pF
Typical thermal resistance (NOTE 3)
RJA
RJL
20
8
/W
Operating junction and storage temperature range
TJ, TSTG
-65 to +175
-55 to +150
NOTES : (1) Reverse recovery test condition : IF 0.5A, IR=1.0A, Irr=0.25A
              (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
              (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead lengths, P.C.B. mounted.

EGP30M Features

` GPRC (Glass Passivated Rectifier Chip) inside
` Glass passivated cavity-free junction
` Superfast recovery time for high efficiency
` Low forward voltage , high current capability
` Low leakage current
` High surge current capability
` High temperature soldering guaranteed: 260/10 seconds, 0.375" (9.5mm) lead length, 5lbs. (2.3 kg) tension
` Plastic package has Underwriters Laboratory Flammability Classification 94V-0

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