ES3FB-TR, ES3F-TR, ES3G Selling Leads, Datasheet
MFG:TSC Package Cooled:DO214AA D/C:09+/10+
ES3FB-TR, ES3F-TR, ES3G Datasheet download
Part Number: ES3FB-TR
MFG: TSC
Package Cooled: DO214AA
D/C: 09+/10+
ES3FB-TR, ES3F-TR, ES3G
- Table of contents:
Info of ES3FB-TR
Info of ES3F-TR
Info of ES3G
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About ES300XN
PDF/DataSheet Download
Datasheet: ES300XN
File Size: 430805 KB
Manufacturer: EPCOS
Download : Click here to Download
About ES300XN
PDF/DataSheet Download
Datasheet: ES300XN
File Size: 430805 KB
Manufacturer: EPCOS
Download : Click here to Download
About ES3G
PDF/DataSheet Download
Datasheet: ES3G
File Size: 75855 KB
Manufacturer: GE [General Semiconductor]
Download : Click here to Download
ES3G Maximum Ratings
|
Ratings at 25°C ambient temperature unless otherwise specified. | ||||
|
|
SYMBOLS |
ES3F |
ES3G |
UNITS |
|
Device marking code |
|
EF |
EG |
|
|
Maximum repetitive peak reverse voltage |
VRRM |
300 |
400 |
Volts |
|
Working peak reverse voltage |
VRWM |
225 |
300 |
Volts |
|
Maximum RMS voltage |
VRMS |
210 |
280 |
Volts |
|
Maximum DC blocking voltage |
VDC |
300 |
400 |
Volts |
|
Maximum average forward rectified current at TL=100°C |
I(AV) |
3.0 |
Amps | |
|
Peak forward surge current |
IFSM |
100 |
Amps | |
|
Maximum instantaneous forward voltage at 3.0A |
VF |
1.10 |
Volts | |
|
Maximum DC reverse current TA=25°C |
IR |
10.0 |
A | |
|
Maximum reverse recovery time (NOTE 1) |
trr |
35 |
ns | |
|
Maximum reverse recovery time (NOTE 2) |
trr |
50 |
ns | |
|
Maximum reverse recovery current (NOTE 2) |
IRM |
3.0 |
Amps | |
|
Maximum stored charge (NOTE 2) |
Qrr |
50 |
ns | |
|
Typical junction capacitance (NOTE 3) |
CJ |
30 |
pF | |
|
Typical thermal resistance (NOTE 4) |
RJA |
50 |
°C/W | |
|
Operating junction and storage temperature range |
TJ, TSTG |
-55 to +150 |
°C | |
ES3G Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-0
For surface mount applications
Low profile package
Built-in strain relief
Ideal for automated placement
Easy pick and place
Superfast recovery time for high efficiency
Glass passivated chip junction
High temperature soldering:250°C/10 seconds at terminals
For surface mount applications
Low profile package
Built-in strain relief
Ideal for automated placement
Easy pick and place
Superfast recovery time for high efficiency
Glass passivated chip junction
High temperature soldering:250°C/10 seconds at terminals
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