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The H21B4, H21B5 and H21B6 consist of a gallium arsenide infrared emitting diode coupled with a silicon photodarlington in a plastic housing. The pack aging system is designed to optimize the mechanical resolution, coupling efficiency, ambient light rejection, cost and reliability. The gap in the housing provides a means of interrupting the signal with an opaque material, switching the output from an "ON" to an "OFF" state.
H21B5 Maximum Ratings
Parameter
Symbol
Rating
Unit
Operating Temperature
T OPR
-55 to +100
°C
Storage Temperature
T STG
-55 to +100
°C
Soldering Temperature (Iron) (2,3 and 4)
T SOL-I
240 for 5 sec
°C
Soldering Temperature (Flow) (2 and 3)
T SOL-F
260 for 10 sec
°C
INPUT (EMITTER) Continuous Forward Current
IF
50
mA
Reverse Voltage
VR
6
V
Power Dissipation (1)
PD
100
mW
OUTPUT (SENSOR) Collector to Emitter Voltage
V CEO
55
V
Emitter to Collector Voltage
V ECO
6
V
Collector Current
IC
40
mA
Power Dissipation (TC = 25°C) (1)
PD
150
mW
1. Derate power dissipation linearly 1.33 mW/°C above 25°C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron tip 1/16" (1.6mm) minimum from housing.
H21B5 Features
• Opaque housing • Low cost • 035" apertures • High I C(ON)
H21B6 Parameters
Technical/Catalog Information
H21B6
Vendor
Fairchild Semiconductor
Category
Sensors, Sensor Evaluation Kits
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
H21B6 H21B6
H21B6 General Description
The H21B4, H21B5 and H21B6 consist of a gallium arsenide infrared emitting diode coupled with a silicon photodarlington in a plastic housing. The pack aging system is designed to optimize the mechanical resolution, coupling efficiency, ambient light rejection, cost and reliability. The gap in the housing provides a means of interrupting the signal with an opaque material, switching the output from an "ON" to an "OFF" state.
H21B6 Maximum Ratings
Parameter
Symbol
Rating
Unit
Operating Temperature
T OPR
-55 to +100
°C
Storage Temperature
T STG
-55 to +100
°C
Soldering Temperature (Iron) (2,3 and 4)
T SOL-I
240 for 5 sec
°C
Soldering Temperature (Flow) (2 and 3)
T SOL-F
260 for 10 sec
°C
INPUT (EMITTER) Continuous Forward Current
IF
50
mA
Reverse Voltage
VR
6
V
Power Dissipation (1)
PD
100
mW
OUTPUT (SENSOR) Collector to Emitter Voltage
V CEO
55
V
Emitter to Collector Voltage
V ECO
6
V
Collector Current
IC
40
mA
Power Dissipation (TC = 25°C) (1)
PD
150
mW
1. Derate power dissipation linearly 1.33 mW/°C above 25°C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron tip 1/16" (1.6mm) minimum from housing.
H21B6 Features
• Opaque housing • Low cost • 035" apertures • High I C(ON)