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HEXFREDTM diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. An extensive characterization of the recovery behavior for different values of current, temperature and di/dt simplifies the calculations of losses in the operating conditions. The softness of the recovery eliminates the need for a snubber in most applications. These devices are ideally suited for power converters, motors drives and other applications where switching losses are significant portion of the total losses.
HFA80NC40CSL Maximum Ratings
Parameter
Max.
Units
VR
Cathode-to-Anode Voltage
400
V
IF @ TC = 25°C
Continuous Forward Current
85
A
IF @ TC = 100°C
Continuous Forward Current
42
IFSM
Single Pulse Forward Current
300
EAS
Non-Repetitive Avalanche Energy
1.4
µJ
PD @ TC = 25°C
Maximum Power Dissipation
150
W
PD @ TC = 100°C
Maximum Power Dissipation
59
TJ
Operating Junction and
-55 to +150
°C
TSTG
Storage Temperature Range
Soldering Temperature, for 10 sec.
300 (0.063 in. (1.6mm) from case)
HFA80NC40CSL Features
• Reduced RFI and EMI • Reduced Snubbing • Extensive Characterization of Recovery Parameters
HFA80NC40CSM General Description
HEXFREDTM diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. An extensive characterization of the recovery behavior for different values of current , temperature and di/dt simplifies the calculations of losses in the operating conditions. The softness of the recovery eliminates the need for a snubber in most applications. These devices are ideally suited for power converters, motors drives and other applications where switching losses are significant portion of the total losses.
HFA80NC40CSM Maximum Ratings
Parameter
Max.
Units
VR
Cathode-to-Anode Voltage
400
V
IF @ TC = 25°C
Continuous Forward Current
85
A
IF @ TC = 100°C
Continuous Forward Current
42
IFSM
Single Pulse Forward Current
300
EAS
Non-Repetitive Avalanche Energy
1.4
µJ
PD @ TC = 25°C
Maximum Power Dissipation
150
W
PD @ TC = 100°C
Maximum Power Dissipation
59
TJ
Operating Junction and
-55 to +150
°C
TSTG
Storage Temperature Range
Soldering Temperature, for 10 sec.
300 (0.063 in. (1.6mm) from case)
HFA80NC40CSM Features
• Reduced RFI and EMI • Reduced Snubbing • Extensive Characterization of Recovery Parameters