HI-8585PSI-N, HI-8586, HI8586PDI Selling Leads, Datasheet
MFG:N/A Package Cooled:NA/ D/C:09+
HI-8585PSI-N, HI-8586, HI8586PDI Datasheet download
Part Number: HI-8585PSI-N
MFG: N/A
Package Cooled: NA/
D/C: 09+
HI-8585PSI-N, HI-8586, HI8586PDI
- Table of contents:
Info of HI-8585PSI-N
Info of HI-8586
Info of HI8586PDI
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About HI-15530
PDF/DataSheet Download
Datasheet: HI-15530
File Size: 320199 KB
Manufacturer: HOLTIC [Holt Integrated Circuits]
Download : Click here to Download
About HI-8586
PDF/DataSheet Download
Datasheet: HI-8586
File Size: 136108 KB
Manufacturer: HOLTIC [Holt Integrated Circuits]
Download : Click here to Download
About HI882
PDF/DataSheet Download
Datasheet: HI882
File Size: 38557 KB
Manufacturer: HSMC [Hi-Sincerity Mocroelectronics]
Download : Click here to Download
HI-8586 General Description
The HI-8585 and HI-8586 are CMOS integrated circuits designed to directly drive the ARINC 429 bus in an 8 pin package. Two logic inputs control a differential voltage between the output pins producing a +10 volt One, a -10volt Zero, anda0volt Null.
The CMOS/TTL control inputs are translated to ARINC specified amplitudes using on board zeners. Alogic input is provided to control the slope of the differential output signal. Timing is set by on-chip resistor and capacitor and testedtobewithinARINCrequirements.
The HI-8585 has 37.5 ohms in series with each line driver output. The HI-8586 pr ovides the option to bypass most of the output resistance so that series protection circuits canadd their resistances.
The HI-8585 or the HI-8586 along with the HI-8588 line receiver offer the smallest options available to get on and off theARINCbus.
HI-8586 Maximum Ratings
Supply voltages V+.......................................................................20V
Supply voltages V-.......................................................................-20V
DC current per input pin.......................................................... +10mA
Power dissipation at 25°C plastic DIL......... 1.0W, derate 10mW/°C
Power dissipation at 25°C ceramic DIL......... 0.5W, derate 7mW/°C
Solder Temperature ................................................ 275°C for 10 sec
Storage Temperature..............................................-65°C to +150°C
Supply voltages V-.......................................................................-20V
DC current per input pin.......................................................... +10mA
Power dissipation at 25°C plastic DIL......... 1.0W, derate 10mW/°C
Power dissipation at 25°C ceramic DIL......... 0.5W, derate 7mW/°C
Solder Temperature ................................................ 275°C for 10 sec
Storage Temperature..............................................-65°C to +150°C
HI-8586 Features
·On-chip zener to set output levels
·On-chip line driver slope control and selection by logic input
·Low current 12 to 15 volt supplies
·CMOS / TTL logic pins
·Plastic and ceramic package options -surface mount and DIP
·Themally enhanced SOIC packages
·Mil processing available
·On-chip line driver slope control and selection by logic input
·Low current 12 to 15 volt supplies
·CMOS / TTL logic pins
·Plastic and ceramic package options -surface mount and DIP
·Themally enhanced SOIC packages
·Mil processing available
HI-8586 Typical Application
Figure 2 shows a possible application of the HI-8585/86 interfacing an ARINC transmit channel fromtheHI-6010.
HI-8586 Connection Diagram
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