HPLR3103, HPLR3103T, HPLU3103 Selling Leads, Datasheet
MFG:Fairchild Package Cooled:N/A D/C:09+
HPLR3103, HPLR3103T, HPLU3103 Datasheet download

Part Number: HPLR3103
MFG: Fairchild
Package Cooled: N/A
D/C: 09+
MFG:Fairchild Package Cooled:N/A D/C:09+
HPLR3103, HPLR3103T, HPLU3103 Datasheet download

MFG: Fairchild
Package Cooled: N/A
D/C: 09+
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Datasheet: HPLR3103
File Size: 73108 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
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PDF/DataSheet Download
Datasheet: HPL0603E-12
File Size: 47027 KB
Manufacturer: ETC [ETC]
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PDF/DataSheet Download
Datasheet: HPLU3103
File Size: 73108 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
These are N-Channel enhancement mode silicon gate power field effect transistors. They are advanced power MOSFETs designed, tested, and guaranteed to withstand a specified level of energy in the breakdown avalanche mode of operation. All of these power MOSFETs are designed for applications such as switching regulators, switching converters, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits.
|
HPLR3103 |
HPLU3103 |
UNITS | ||
| Drain to Source Voltage (Note 1) |
VDSS |
30 |
V | |
| Drain to Gate Voltage (RGS = 20kW) (Note 1) |
VDGR |
30 |
V | |
| Gate to Source Voltage |
VGS |
±16V |
V | |
| Continuous Drain Current |
ID |
52 |
A | |
| Pulsed Drain Current (Note 2) |
IDM |
390 |
A | |
| Single Pulse Avalanche Energy (Note 4) |
EAS |
240 |
mj | |
| Power Dissipation |
PD |
89 |
W | |
| Derate Above 25 |
0.71 |
W/ | ||
| Operating and Storage Temperature |
TJ, TSTG |
-55 to 150 |
||
| Maximum Temperature for Soldering | ||||
| Leads at 0.063in (1.6mm) from Case for 10s. |
TL |
300 |
||
| Package Body for 10s, See Techbrief 334 |
Tpkg |
260 |
||

These are N-Channel enhancement mode silicon gate power field effect transistors. They are advanced power MOSFETs designed, tested, and guaranteed to withstand a specified level of energy in the breakdown avalanche mode of operation. All of these power MOSFETs are designed for applications such as switching regulators, switching converters, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits.
|
HPLR3103 |
HPLU3103 |
UNITS | ||
| Drain to Source Voltage (Note 1) |
VDSS |
30 |
V | |
| Drain to Gate Voltage (RGS = 20kW) (Note 1) |
VDGR |
30 |
V | |
| Gate to Source Voltage |
VGS |
±16V |
V | |
| Continuous Drain Current |
ID |
52 |
A | |
| Pulsed Drain Current (Note 2) |
IDM |
390 |
A | |
| Single Pulse Avalanche Energy (Note 4) |
EAS |
240 |
mj | |
| Power Dissipation |
PD |
89 |
W | |
| Derate Above 25 |
0.71 |
W/ | ||
| Operating and Storage Temperature |
TJ, TSTG |
-55 to 150 |
||
| Maximum Temperature for Soldering | ||||
| Leads at 0.063in (1.6mm) from Case for 10s. |
TL |
300 |
||
| Package Body for 10s, See Techbrief 334 |
Tpkg |
260 |
||

