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HS3B, HS3BB, HS3D

HS3B, HS3BB, HS3D Selling Leads, Datasheet

MFG:TSC  Package Cooled:SMC/DO-214AB  D/C:09+

HS3B, HS3BB, HS3D Picture

HS3B, HS3BB, HS3D Datasheet download

Five Points

Part Number: HS3B

 

MFG: TSC

Package Cooled: SMC/DO-214AB

D/C: 09+

 

 

 
 
 
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HS3B Suppliers

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  • HS301-I/SN

  • Vendor: Microchip D/C: 07+&   Adddate: 2024-03-28
  • Inquire Now
  • TEAM SOURCE (HK) LIMITED   China
    Contact: Ms.edithchen   MSN:EDITH_CHEN@126.COM
    Tel: 86-755-33060402 33062656
    Fax: 86-755-33062657
    (0)
  • HS321A

  • Vendor: PHILIPS Pack: CDIP D/C: 90+& Qty: 200  Adddate: 2024-03-28
  • Inquire Now
  • SHENZHEN KINGS ELECTRONICS   China
    Contact: Mr.zheng   MSN:hfh-ic@hotmail.com
    Tel: 86-755-82532828
    Fax: 86-755-23956399
    (0)
  • HS353064

  • Vendor: LG Qty: 996 Note: NEW AND ORIGINAL  Adddate: 2024-03-28
  • Inquire Now
  • Mengyang Electronic Co.   China
    Contact: Ms.Zhao   MSN:mydz1@hotmail.com
    Tel: 86-755-83223505
    Fax: 86-755-83237183
    (10)

About HS3B

PDF/DataSheet Download

Datasheet: HS3B

File Size: 48986 KB

Manufacturer: TSC [Taiwan Semiconductor Company, Ltd]

Download : Click here to Download

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HS3BB Suppliers

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  • HS301-I/SN

  • Vendor: Microchip D/C: 07+&   Adddate: 2024-03-28
  • Inquire Now
  • TEAM SOURCE (HK) LIMITED   China
    Contact: Ms.edithchen   MSN:EDITH_CHEN@126.COM
    Tel: 86-755-33060402 33062656
    Fax: 86-755-33062657
    (0)
  • HS321A

  • Vendor: PHILIPS Pack: CDIP D/C: 90+& Qty: 200  Adddate: 2024-03-28
  • Inquire Now
  • SHENZHEN KINGS ELECTRONICS   China
    Contact: Mr.zheng   MSN:hfh-ic@hotmail.com
    Tel: 86-755-82532828
    Fax: 86-755-23956399
    (0)
  • HS353064

  • Vendor: LG Qty: 996 Note: NEW AND ORIGINAL  Adddate: 2024-03-28
  • Inquire Now
  • Mengyang Electronic Co.   China
    Contact: Ms.Zhao   MSN:mydz1@hotmail.com
    Tel: 86-755-83223505
    Fax: 86-755-83237183
    (10)

About HS3140

PDF/DataSheet Download

Datasheet: HS3140

File Size: 148004 KB

Manufacturer: SIPEX [Sipex Corporation]

Download : Click here to Download

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HS3D Suppliers

More HS3D Suppliers

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  • HS301-I/SN

  • Vendor: Microchip D/C: 07+&   Adddate: 2024-03-28
  • Inquire Now
  • TEAM SOURCE (HK) LIMITED   China
    Contact: Ms.edithchen   MSN:EDITH_CHEN@126.COM
    Tel: 86-755-33060402 33062656
    Fax: 86-755-33062657
    (0)
  • HS321A

  • Vendor: PHILIPS Pack: CDIP D/C: 90+& Qty: 200  Adddate: 2024-03-28
  • Inquire Now
  • SHENZHEN KINGS ELECTRONICS   China
    Contact: Mr.zheng   MSN:hfh-ic@hotmail.com
    Tel: 86-755-82532828
    Fax: 86-755-23956399
    (0)
  • HS353064

  • Vendor: LG Qty: 996 Note: NEW AND ORIGINAL  Adddate: 2024-03-28
  • Inquire Now
  • Mengyang Electronic Co.   China
    Contact: Ms.Zhao   MSN:mydz1@hotmail.com
    Tel: 86-755-83223505
    Fax: 86-755-83237183
    (10)

About HS3D

PDF/DataSheet Download

Datasheet: HS3D

File Size: 48986 KB

Manufacturer: TSC [Taiwan Semiconductor Company, Ltd]

Download : Click here to Download

Related PDF Download

Related Part Number

HS3B Maximum Ratings

Rating at 25ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%

Type Number
Symbol
HS
3A
HS
3B
HS
3D
HS
3F
HS
3G
HS
3J
HS
3K
HS
M
Units
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
300
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
210
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
300
400
600
800
1000
V
Maximum Average Forward Rectified
Current See Fig. 2
I(AV)
3.0
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
IFSM
150
A

Maximum Instantaneous Forward Voltage
@3.0A

VF
1.0
1.3
1.7
V
Maximum DC Reverse Current@ TA=25
at Rated DC Blocking Voltage @ TA=100
IR

10.0
200

uA
uA
Maximum Reverse Recovery Time (Note 1)
Trr
50
75
nS
Typical Junction Capacitance (Note 2)
Cj
80
50
pF
Operating Temperature Range
TJ
-55 to +150
Storage Temperature Range
TSTG
-55 to +150

Notes: 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
           2. Measured at 1 MHz and Applied VR=4.0 Volts
           3. Mounted on P.C.B. with 0.6"x0.6" ( 16 x 16 mm ) Copper Pad Areas.

HS3B Features

`Glass passivated junction chip.
` For surface mounted application
` Low forward voltage drop
` Low profile package
` Built-in stain relief, ideal for automatic placement
` Fast switching for high efficiency
` High temperature soldering: 260/10 seconds at terminals
` Plastic material used carries Underwriters Laboratory Classification 94V-O

HS3BB Maximum Ratings

PARAMETER
SYMBOL
HS3AB
HS3BB
HS3DB
HS3GB
HS3JB
HS3KB
HS3MB
UNIT
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS Bridge Input Voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
800
1000
V
Maximum Average Forward Current .375" (9.5mm)
lead length at TA=55
I(AV)
3.0
A
Peak Forward Surge Current : 8.3ms si ngle half si ne-wave superimposed on rated load(JEDEC method)
IFSM
150
A
Maximum Forward Voltage at 1.0A
VF
01.0
1.3
1.7
V
Maximum DC Reverse Current TJ=25
at Rated DC Blocking Voltage TJ=110
IR
5.0
100
uA
Typical Junction capacitance
CJ
50
30
pF
Typical Thermal Resistance
RJA
20
/W
Maximum Reverse Recovery Time
TRR
50
75
ns
Operating Temperature Range
TJ
-55 to +150
Storage Temperature Range
TSTG
-55 to + 150

HS3BB Features

Low cost
Diffused junction
Ultra fast switching for high efficiency
Low reverse leakage current
Low forward voltage drop
High current capability
The plastic material carries UL recognition 94V-0

HS3D Maximum Ratings

Rating at 25ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%

Type Number
Symbol
HS
3A
HS
3B
HS
3D
HS
3F
HS
3G
HS
3J
HS
3K
HS
M
Units
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
300
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
210
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
300
400
600
800
1000
V
Maximum Average Forward Rectified
Current See Fig. 2
I(AV)
3.0
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
IFSM
150
A

Maximum Instantaneous Forward Voltage
@3.0A

VF
1.0
1.3
1.7
V
Maximum DC Reverse Current@ TA=25
at Rated DC Blocking Voltage @ TA=100
IR

10.0
200

uA
uA
Maximum Reverse Recovery Time (Note 1)
Trr
50
75
nS
Typical Junction Capacitance (Note 2)
Cj
80
50
pF
Operating Temperature Range
TJ
-55 to +150
Storage Temperature Range
TSTG
-55 to +150

Notes: 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
           2. Measured at 1 MHz and Applied VR=4.0 Volts
           3. Mounted on P.C.B. with 0.6"x0.6" ( 16 x 16 mm ) Copper Pad Areas.

HS3D Features

`Glass passivated junction chip.
` For surface mounted application
` Low forward voltage drop
` Low profile package
` Built-in stain relief, ideal for automatic placement
` Fast switching for high efficiency
` High temperature soldering: 260/10 seconds at terminals
` Plastic material used carries Underwriters Laboratory Classification 94V-O

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