MFG:HYNIX Package Cooled:2009+ROHS D/C:1500
HY27UF082G2A-TPCB, HY27UF082G2M, HY27UF082G2M-TPCB Datasheet download
MFG: HYNIX
Package Cooled: 2009+ROHS
D/C: 1500
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PDF/DataSheet Download
Datasheet: HY2001
File Size: 308888 KB
Manufacturer: ETC
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HY27UF082G2M
File Size: 512132 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HY2001
File Size: 308888 KB
Manufacturer: ETC
Download : Click here to Download
The HYNIX HY27UF(08/16)2G2M series is a 256Mx8bit with spare 8Mx8 bit capacity. The device is offered in 3.3V Vcc Power Supply.
Its NAND cell provides the most cost-effective solution for the solid state mass storage market.
The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased.
The device contains 2048 blocks, composed by 64 pages consisting in two NAND structures of 32 series connected Flash cells.
A program operation allows to write the 2112-byte page in typical 200us and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) block.
Data in the page mode can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. This interface allows a reduced pin count and easy migration towards different densities, without any rearrangement of footprint.
Commands, Data and Addresses are synchronously introduced using CE#, WE#, ALE and CLE input pin. The on-chip Program/Erase Controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data.
The modifying can be locked using the WP# input pin. The output pin RB# (open drain buffer) signals the status of the device during each operation. In a system with multiple memories the RB# pins can be connected all together to provide a global status signal.
Even the write-intensive systems can take advantage of the HY27UF(08/16)1G2M extended reliability of 100K program/ erase cycles by providing ECC (Error Correcting Code) with real time mapping-out algorithm.Optionally the chip could be offered with the CE# don't care function. This option allows the direct download of the code from the NAND Flash memory device by a microcontroller, since the CE# transitions do not stop the read operation.
The copy back function allows the optimization of defective blocks management: when a page program operation fails
the data can be directly programmed in another page inside the same array section without the time consuming serial
data insertion phase.
The cache program feature allows the data insertion in the cache register while the data register is copied into the flash array. This pipelined program operation improves the program throughput when long files are written inside the memory.
A cache read feature is also implemented. This feature allows to dramatically improve the read throughput when consecutive pages have to be streamed out.
This device includes also extra features like OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension.
The HYNIX HY27UF(08/16)2G2M series is available in 48 - TSOP1 12 x 20 mm, 52-ULGA 12 x 17 mm.
Price: 4-6 USD
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