MFG:International Rectifier Category:Discrete Semiconductor Products Package Cooled:TO-262 D/C:04+
Category: Discrete Semiconductor Products
MFG: International Rectifier
Package Cooled: TO-262
D/C: 04+
Description: MOSFET N-CH 30V 38A TO-220AB
1
10
100
250
500
1000
2500
10000
1.96000
1.21200
.88660
.82992
.78384
.73440
.70272
.64320
1.96
12.12
88.66
207.48
391.92
734.40
1756.80
6432.00
MFG: IR Qty: 15000
Tel: 86-755-28536689
Adddate: 2010-03-18
MFG: IR Package Cooled: TO-262 D/C: 07+pbfree Qty: 10000
Singo(HK)technology Co.,Limited 
Tel: 0086-0755-82817286
Adddate: 2010-03-18
MFG: IR Package Cooled: TO-262 D/C: 09+ Qty: 50000
Aslan Internatinal Trade Co., Limited 
Tel: 86-754-84420881
Adddate: 2010-03-18
MFG: IR Package Cooled: TO-262 D/C: `06+(pb-free) Qty: 7536 Note: new in stock
Contact: Ms.Melody Chen/Julie Chen
Tel: 86-755-82535765
Adddate: 2010-03-18
Qty: 25500
Tel: 86-755-28536689
Adddate: 2010-03-18
MFG: IR Package Cooled: TO-262 D/C: 06+ Qty: 7850 Note: in stock now
KANSHEN (HONGKONG)INDUSTRIAL LIMITED 
Tel: 86-755-88301637
Adddate: 2010-03-18
MFG: TO-262 Package Cooled: 7850 D/C: IR Qty: 06+
KANSHEN (HONGKONG)INDUSTRIAL LIMITED 
Tel: 86-755-88301637
Adddate: 2010-03-18
MFG: IR D/C: 09+/pb Qty: 30000
HONG KONG TERRY ELECTRONICS INTERNATIONAL COMPANY 
Tel: 86-755-23956340
Adddate: 2010-03-18
PDF/DataSheet Download
Datasheet: IRL3303L
File Size: 426094 KB
Manufacturer:
Download : Click here to Download
MFG: IR Package Cooled: TO-263 D/C: 0131+ Qty: 5 Note: avail
Tel: 86-755-33972498
Adddate: 2010-03-18
MFG: IR Package Cooled: 4000 D/C: 07+08+ Qty: TO-263
SHENZHEN JINGYI ELECTRONICS TECHNOLOGYCO.,LIMITED 
Tel: 86-0755-83852031
Adddate: 2010-03-18
MFG: IR Package Cooled: TO-263 D/C: 08+ Qty: 15000 Note: New and unused in stock.
HK HUITONG ELECTRONIC TECHNOLOGY LIMITED 
Tel: 086-0755-82523694
Adddate: 2010-03-18
MFG: IR/KA Package Cooled: 6000 D/C: TO-
Tel: 86-755-83958497
Adddate: 2010-03-18
MFG: 26521 Package Cooled: I R Qty:
TACT (H.K.) Century Co., Limited 
Tel: 0086-0755-83014280
Adddate: 2010-03-18
MFG: IR Qty: 25500
Tel: 86-755-28536689
Adddate: 2010-03-18
MFG: IR/KA Package Cooled: TO- Qty: 1120 Note: Delivery
Golden Harbour Industry Limited 
Tel: 86-755-83651739,83041561
Adddate: 2010-03-18
MFG: IR Package Cooled: D2-Pak D/C: 07+pbfree Qty: 7020
Singo(HK)technology Co.,Limited 
Tel: 0086-0755-82817286
Adddate: 2010-03-18
PDF/DataSheet Download
Datasheet: IRL3303S
File Size: 161891 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
MFG: IR D/C: 09+/pb Qty: 30000
HONG KONG TERRY ELECTRONICS INTERNATIONAL COMPANY 
Tel: 86-755-23956340
Adddate: 2010-03-18
MFG: IR Package Cooled: 7,000
Tel: 65-6333-9155
Adddate: 2010-03-18
MFG: IR D/C: N/A Qty: 100000 Note: New & Original/stock
SHENZHEN MINGJIADA ELECTRONICS CO.,LTD 
Tel: 86-0755-83957301
Adddate: 2010-03-18
MFG: IR Package Cooled: TO-252 D/C: new Qty: 7600 Note: REAL STOCK
Win Source Electronic Technology Limited 
Tel: 86-755-83566469 83957766
Adddate: 2010-03-18
MFG: IR Package Cooled: SMD D/C: 03+ Qty: 3650 Note: special supplier for wirless digital communication goods
Zhengxinyuan ELectronics(HongKong)Co.LTD 
Tel: 086-0755-88822655
Adddate: 2010-03-18
MFG: IR/KA Package Cooled: 6000 D/C: TO-
Tel: 86-755-83958497
Adddate: 2010-03-18
MFG: 52852 Package Cooled: I R Qty:
TACT (H.K.) Century Co., Limited 
Tel: 0086-0755-83014280
Adddate: 2010-03-18
PDF/DataSheet Download
Datasheet: IRL1004
File Size: 91524 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieveextremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides thehighest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRL3303L) is available for lowprofile applications
| Parameter | Max. | Units | |
| ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V⑤ | 38 | A |
| ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V⑤ | 27 | |
| IDM | Pulsed Drain Current①⑤ | 140 | |
| PD @TC = 25°C | Power Dissipation | 3.8 | W |
| PD @TC = 25°C |
Power Dissipation |
68 |
W |
| Linear Derating Factor | 0.45 | W/°C | |
| VGS | Gate-to-Source Voltage | ± 16 | V |
| EAS | Single Pulse Avalanche Energy②⑤ | 130 | mJ |
| IAR | Avalanche Current① | 20 | A |
| EAR | Repetitive Avalanche Energy① | 6.8 | mJ |
| dv/dt | Peak Diode Recovery dv/dt ③⑤ | 5.0 | V/ns |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 | °C |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) |
| Technical/Catalog Information | IRL3303PBF |
| Vendor | International Rectifier |
| Category | Discrete Semiconductor Products |
| Mounting Type | Through Hole |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 30V |
| Current - Continuous Drain (Id) @ 25° C | 38A |
| Rds On (Max) @ Id, Vgs | 26 mOhm @ 20A, 10V |
| Input Capacitance (Ciss) @ Vds | 870pF @ 25V |
| Power - Max | 68W |
| Packaging | Tube |
| Gate Charge (Qg) @ Vgs | 26nC @ 4.5V |
| Package / Case | TO-220-3 (Straight Leads) |
| FET Feature | Logic Level Gate |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | IRL3303PBF IRL3303PBF |
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieveextremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides thehighest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRL3303L) is available for lowprofile applications
| Parameter | Max. | Units | |
| ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V⑤ | 38 | A |
| ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V⑤ | 27 | |
| IDM | Pulsed Drain Current①⑤ | 140 | |
| PD @TC = 25°C | Power Dissipation | 3.8 | W |
| PD @TC = 25°C |
Power Dissipation |
68 |
W |
| Linear Derating Factor | 0.45 | W/°C | |
| VGS | Gate-to-Source Voltage | ± 16 | V |
| EAS | Single Pulse Avalanche Energy②⑤ | 130 | mJ |
| IAR | Avalanche Current① | 20 | A |
| EAR | Repetitive Avalanche Energy① | 6.8 | mJ |
| dv/dt | Peak Diode Recovery dv/dt ③⑤ | 5.0 | V/ns |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 | °C |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) |