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V = 15 V, T VJ = 125, RG = 22 Clamped inductive load, L = 100 H
ICM = 44 @ 0.8 VCES
A
PC
TC = 25
W
TJ TJM Tstg
-55 ... +150 150 -55 ... +150
Maximum Lead and Tab temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
Md
Mounting torque, TO-247 AD
1.13/10
Nm/lb.in.
Weight
TO-247 SMD TO-247 AD
4 6
g g
IXGH22N50BU1 Features
• International standard packagesJEDEC TO-247 SMD surfacemountable and JEDEC TO-247 AD • High frequency IGBT and antiparallelFRED in one package • High current handling capability • HiPerFASTTM HDMOSTM process • MOS Gate turn-on - drive simplicity
IXGH22N50BU1 Typical Application
• Uninterruptible power supplies (UPS) • Switched-mode and resonant-modepower supplies • AC motor speed control • DC servo and robot drives • DC choppers
Maximum Lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Maximum Tab temperature for soldering SMD devices for 10 s
300 260
°C °C
Md
Mounting torque (M3)
1.13/10Nm/lb.in.
Weight
TO-247 AD TO-268
6 4
g g
IXGH24N170 Features
International standard packages JEDEC TO-268 and JEDEC TO-247 AD High current handling capability MOS Gate turn-on - drive simplicity Rugged NPT structure Molding epoxies meet UL 94 V-0 flammability classification
IXGH24N170 Typical Application
Capacitor discharge & pulser circuits AC motor speed control DC servo and robot drives DC choppers Uninterruptible power supplies (UPS) Switched-mode and resonant-mode power supplies