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Maximum Lead and Tab temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
Md
Mounting torque
1.13/10
Nm/lb.in
Weight
6
g
IXGH24N60BU1 Features
• High frequency IGBT and antiparallelFRED in one package • High current handling capability • 3rd generation HDMOSTM process • MOS Gate turn-on - drive simplicity
IXGH24N60BU1 Typical Application
• AC motor speed control • DC servo and robot drives • DC choppers • Uninterruptible power supplies(UPS) • Switched-mode and resonant-modepower supplies
IXGH24N60CD1 Parameters
Technical/Catalog Information
IXGH24N60CD1
Vendor
IXYS
Category
Discrete Semiconductor Products
Input Type
Standard
Voltage - Collector Emitter Breakdown (Max)
600V
Current - Collector (Ic) (Max)
48A
Vce(on) (Max) @ Vge, Ic
2.5V @ 15V, 24A
Power - Max
150W
Mounting Type
Through Hole
Package / Case
TO-247AD
Packaging
Tube
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
IXGH24N60CD1 IXGH24N60CD1
IXGH24N60CD1 Maximum Ratings
Symbol
Test Conditions
Maximum
Ratings
VDSS VDGR
TJ = 25°C to 150°C TJ = 25°C to 150°C; RGS = 1 M
600 600
V V
VGS VGSM
Continuous Transient
±20 ±30
V V
Ic25 Ic90 ICM
TC = 25°C TC = 90°C TC = 25°C 1 ms
48 24 80
A A A
SSOA (RBSOA)
VGE= 15 V, TVJ = 125°C, RG = 10 Clamped inductive load, L = 100 H
ICM = 48 @ 0.8 VCES
V/ns
Pc
TC = 25°C
150
W
TJ TJM Tstg
-55 ... +150 150 -55 ... +150
°C °C °C
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C °C
Md
Mounting torque (M3)
1.13/10
Nm/lb.in.
Weight
TO-247 TO-268
4 6
g g
IXGH24N60CD1 Features
• International standard packages JEDEC TO-247 and surface mountable TO-268 • High frequency IGBT • High current handling capability • Latest generation HDMOSTM process • MOS Gate turn-on - drive simplicity • Fast recovery expitaxial Diode (FRED) - soft recovery with low IRM
IXGH24N60CD1 Typical Application
• PFC circuits • Uninterruptible power supplies (UPS) • Switched-mode and resonant-mode power supplies • AC motor speed control • DC servo and robot drives • DC choppers