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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300 °C
Md
Mounting torque (TO-220)
M3 0.45/4 Nm/lb.in. M3.5 0.55/5 Nm/lb.in.
IXGP20N60B Features
· International standard packages JEDEC TO-263 surface mountable and JEDEC TO-220 AB · High frequency IGBT · High current handling capability · HiPerFASTTM HDMOSTM process · MOS Gate turn-on- drive simplicity
IXGP20N60B Typical Application
·Uninterruptible power supplies (UPS) ·Switched-mode and resonant-mode power supplies ·AC motor speed control ·DC servo and robot drives ·DC choppers
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
Md
Mounting torque (M3)
1.13/10
Nm/lb.in.
Weight
TO-263 TO-220
2 4
g g
IXGP24N60C Features
International standard packages JEDEC TO-247 and surface mountable TO-268 High frequency IGBT High current handling capability Latest generation HDMOSTM process MOS Gate turn-on - drive simplicity
IXGP24N60C Typical Application
PFC circuits Uninterruptible power supplies (UPS) Switched-mode and resonant-mode power supplies AC motor speed control DC servo and robot drives DC choppers
