K6F2016U4E, K6F2016U4E-EF55, K6F2016U4E-EF55T00 Selling Leads, Datasheet
MFG:300 Package Cooled:BGA D/C:BGA
K6F2016U4E, K6F2016U4E-EF55, K6F2016U4E-EF55T00 Datasheet download
Part Number: K6F2016U4E
MFG: 300
Package Cooled: BGA
D/C: BGA
MFG:300 Package Cooled:BGA D/C:BGA
K6F2016U4E, K6F2016U4E-EF55, K6F2016U4E-EF55T00 Datasheet download
MFG: 300
Package Cooled: BGA
D/C: BGA
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PDF/DataSheet Download
Datasheet: K6F2016U4E
File Size: 162264 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6F1008V2C
File Size: 129867 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6F1008V2C
File Size: 129867 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
The K6F2016U4E families are fabricated by SAMSUNG¢s advanced full CMOS process technology. The families support industrial temperature range and 48 ball Chip Scale Package for user flexibility of system design. The families also support low data retention voltage for battery back-up operation with low data retention current.
Item |
Symbol |
Ratings |
Unit |
Voltage on any pin relative to Vss |
VIN, VOUT |
-0.2 to VCC+0.3V |
V |
Voltage on Vcc supply relative to Vss |
VCC |
-0.2 to 3.6V |
V |
Power Dissipation |
PD |
1.0 |
W |
Storage temperature |
TSTG |
-65 to 150 |
°C |
Operating Temperature |
TA |
-40 to 85 |
°C |