K6F8016U6CFF55, K6F8016U6C-FF70, K6F8016U6D Selling Leads, Datasheet
MFG:SAM Package Cooled:BGA D/C:2004
K6F8016U6CFF55, K6F8016U6C-FF70, K6F8016U6D Datasheet download
Part Number: K6F8016U6CFF55
MFG: SAM
Package Cooled: BGA
D/C: 2004
MFG:SAM Package Cooled:BGA D/C:2004
K6F8016U6CFF55, K6F8016U6C-FF70, K6F8016U6D Datasheet download
MFG: SAM
Package Cooled: BGA
D/C: 2004
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PDF/DataSheet Download
Datasheet: K6F1008V2C
File Size: 129867 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6F1008V2C
File Size: 129867 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6F8016U6D
File Size: 158066 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
The K6F8016U6D families are fabricated by SAMSUNGs advanced full CMOS process technology. The families support industrial operating temperature ranges and have chip scale package for user flexibility of system design. The families also support low data retention voltage for battery back-up operation with low data retention current.
Item | Symbol | Ratings | Unit |
Voltage on any pin relative to Vss | VIN,VOUT | -0.3 to VCC+0.3V(Max. 3.6V) | V |
Voltage on Vcc supply relative to Vss | VCC | -0.3 to 3.6 | V |
Power Dissipation | PD | 1.0 | W |
Storage temperature | TSTG | -65 to 150 | °C |
Operating Temperature | TA | -40 to 85 | °C |
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be restricted to be used under recommended operating condition. Exposure to absolute maximum rating conditions over 1 second may affect reliability.