K6T4008C18-GB70, K6T4008C1B, K6T4008C1B-55 Selling Leads, Datasheet
MFG:SAMSUNG Package Cooled:SOP D/C:07+
K6T4008C18-GB70, K6T4008C1B, K6T4008C1B-55 Datasheet download
Part Number: K6T4008C18-GB70
MFG: SAMSUNG
Package Cooled: SOP
D/C: 07+
MFG:SAMSUNG Package Cooled:SOP D/C:07+
K6T4008C18-GB70, K6T4008C1B, K6T4008C1B-55 Datasheet download
MFG: SAMSUNG
Package Cooled: SOP
D/C: 07+
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PDF/DataSheet Download
Datasheet: K6T0808C1D
File Size: 174409 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6T4008C1B
File Size: 175104 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6T0808C1D
File Size: 174409 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
The K6T4008C1B families are fabricated by SAMSUNG¢s advanced CMOS process technology. The families support various operating temperature ranges and various package types for user flexibility of system design. The family also support low data retention voltage for battery back-up operation with low data retention current.
Item | Symbol | Ratings | Unit | Remark |
Voltage on any pin relative to Vss | VIN,VOUT | -0.5 to 7.0 | V | - |
Voltage on Vcc supply relative to Vss | VCC | -0.5 to 7.0 | V | - |
Power Dissipation | PD | 1.0 | W | - |
Storage temperature | TSTG | -65 to 150 | °C | - |
Operating Temperature | TA | 0 to 70 | °C | K6T4008C1B-L/-B |
-40 to 85 | °C | K6T4008C1B-P/-F | ||
Soldering temperature and time | TSOLDER | 260°C, 10sec(Lead Only) | - | - |