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MFG:SAMSUNG  Package Cooled:TQFP  D/C:09+

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K7B403625B-QI85, K7B403625M, K7B403625M-90 Datasheet download

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Part Number: K7B403625B-QI85

 

MFG: SAMSUNG

Package Cooled: TQFP

D/C: 09+

 

 

 
 
 
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About K7B161825A

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Datasheet: K7B161825A

File Size: 270328 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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  • K7B403625M-QC80

  • Vendor: SAMSUNG Pack: QFP D/C: 05+& Qty: 1600 Note: new and orignal  Adddate: 2024-04-16
  • Inquire Now
  • XYC ELECTRONIC COMPANY   China
    Contact: Ms.AiXun   MSN:sale.ic@hotmail.com
    Tel: 86-0755-61617705
    Fax: 86-0755-61617706
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About K7B403625M

PDF/DataSheet Download

Datasheet: K7B403625M

File Size: 450043 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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About K7B161825A

PDF/DataSheet Download

Datasheet: K7B161825A

File Size: 270328 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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K7B403625M General Description

The K7B403625M is a 4,718,592 Synchronous Static Random Access Memory designed for high performance second level cache of Pentium and Power PC based System.

It is organized as 64K words of 36bits and integrates address and control registers, a 2-bit burst address counter and added some new functions for high performance cache RAM applications;GW, BW, LBO, ZZ. Write cycles are internally self-timed and synchronous.

Full bus-width write is done by GW, and each byte write is performed by the combination of WEx and BW when GW is high.And with CS1 high, ADSP is blocked to control signals.

Burst cycle can be initiated with either the address status processor(ADSP) or address status cache controller(ADSC)inputs. Subsequent burst addresses are generated internally in the system¢s burst sequence and are controlled by the burst address advance(ADV) input.

LBOpin is DC operated and determines burst sequence(linear or interleaved).

ZZ pin controls Power Down State and reduces Stand-by current regardless of CLK.

The K7A203600A is fabricated using SAMSUNG¢s high performance CMOS technology and is available in a 100pin TQFP package. Multiple power and ground pins are utilized to minimize ground bounce.

K7B403625M Maximum Ratings

PARAMETER SYMBOL RATING UNIT
Voltage on VDD Supply Relative to VSS VDD -0.3 to 4.6 V
Voltage on VDDQ Supply Relative to VSS VDDQ VDD V
Voltage on Input Pin Relative to VSS VIN -0.3 to 6.0 V
Voltage on I/O Pin Relative to VSS VIO -0.3 to VDDQ+0.5 V
Power Dissipation PD 1.2 W
Storage Temperature TSTG -65 to 150 °C
Operating Temperature TOPR 0 to 70 °C
Storage Temperature Range Under Bias TBIAS -10 to 85 °C

*Note : Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

K7B403625M Features

• Synchronous Operation.
• On-Chip Address Counter.
• Write Self-Timed Cycle.
• On-Chip Address and Control Registers.
• VDD= 3.3V+0.3V/-0.165V Power Supply.
• VDDQ Supply Voltage 3.3V+0.3V/-0.165V for 3.3V I/O or 2.5V+0.4V/-0.125V for 2.5V I/O.
• 5V Tolerant Inputs except I/O Pins.
• Byte Writable Function.
• Global Write Enable Controls a full bus-width write.
• Power Down State via ZZ Signal.
• Asynchronous Output Enable Control.
ADSP, ADSCADV Burst Control Pins.
LBO Pin allows a choice of either a interleaved burst or a linear burst.
• Three Chip Enables for simple depth expansion with No Data Contention.
• TTL-Level Three-State Output.
• 100-TQFP-1420A

K7B403625M Connection Diagram

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