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K9F2G08U0M, K9F2G08U0M-IIB0, K9F2G08U0M-PCB0/YCB0

K9F2G08U0M, K9F2G08U0M-IIB0, K9F2G08U0M-PCB0/YCB0 Selling Leads, Datasheet

MFG:AMD  Package Cooled:TSOP  D/C:09+

K9F2G08U0M, K9F2G08U0M-IIB0, K9F2G08U0M-PCB0/YCB0 Picture

K9F2G08U0M, K9F2G08U0M-IIB0, K9F2G08U0M-PCB0/YCB0 Datasheet download

Five Points

Part Number: K9F2G08U0M

 

MFG: AMD

Package Cooled: TSOP

D/C: 09+

 

 

 
 
 
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About K9F2G08U0M

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Datasheet: K9F2G08U0M

File Size: 860032 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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K9F2G08U0M-IIB0 Suppliers

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  • K9F1208Q0B-JIB0

  • Vendor: SAMSUNG D/C: 04+& Qty: 815  Adddate: 2024-04-18
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  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
    (5)
  • K9F1208QOB-JIBO

  • Vendor: SAMSUNG D/C: 04+& Qty: 768  Adddate: 2024-04-18
  • Inquire Now
  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
    (5)

About K9F1208B0B

PDF/DataSheet Download

Datasheet: K9F1208B0B

File Size: 1054247 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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K9F2G08U0M-PCB0/YCB0 Suppliers

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  • K9F1208Q0B-JIB0

  • Vendor: SAMSUNG D/C: 04+& Qty: 815  Adddate: 2024-04-18
  • Inquire Now
  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
    (5)
  • K9F1208QOB-JIBO

  • Vendor: SAMSUNG D/C: 04+& Qty: 768  Adddate: 2024-04-18
  • Inquire Now
  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
    (5)

About K9F1208B0B

PDF/DataSheet Download

Datasheet: K9F1208B0B

File Size: 1054247 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

Download : Click here to Download

Related PDF Download

Related Part Number

K9F2G08U0M General Description

Offered in 256Mx8bit or 128Mx16bit, the K9F2GXXX0M is 2G bit with spare 64M bit capacity.  Its NAND cell provides the most cost- effective solution for the solid state mass storage market. A program operation can be performed in typical 300ms on the 2112- byte(X8 device) or 1056-word(X16 device) page  and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) or 64K-word(X16 device) block. Data in the data page can be read out at 50ns(30ns, only X8 device) cycle time per byte or word(X16 device)..

The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F2GXXX0Ms extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F2GXXX0M is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non volatility.              

K9F2G08U0M Maximum Ratings

Parameter Symbol Rating Unit
K9F2GXXQ0M(1.8V) K9F2GXXU0M(3.3V)
Voltage on any pin relative to VSS VIN/OUT
-0.6to+2.45 -0.6to+4.6 V
VCC -0.6 to + 2.45 -0.6 to + 4.6
TemperatureUnderBias K9F2GXXU0M-XCB0 TBIAS
-10 to +125
°C
K9F2GXXU0M-XIB0 -40 to +125
Storage Temperature K9F2GXXU0M-XCB0 TSTG -40 to +125 °C
K9F2GXXU0M-XIB0
Short Circuit Current Ios

5

mA

K9F2G08U0M Features

Voltage Supply
    -1.8V device(K9F2GXXQ0M): 1.70V~1.95V
    -3.3V device(K9F2GXXU0M):  2.7 V ~3.6 V
Organization
    - Memory Cell Array
    -X8   device(K9F2G08X0M) : (256M + 8,192K)bit x 8bit
    -X16 device(K9F2G16X0M) : (128M + 4,096K)bit x 16bit
    - Data Register   
    -X8   device(K9F2G08X0M):  (2K + 64)bit x8bit
    -X16 device(K9F2G16X0M):  (1K + 32)bit x16bit
    - Cache Register
    -X8   device(K9F2G08X0M) :  (2K + 64)bit x8bit
    -X16 device(K9F2G16X0M) :  (1K + 32)bit x16bit
Automatic Program and Erase
    - Page Program
    -X8   device(K9F2G08X0M) :  (2K + 64)Byte
    -X16 device(K9F2G16X0M) :  (1K + 32)Word
    - Block Erase
    -X8   device(K9F2G08X0M) :  (128K + 4K)Byte
    -X16 device(K9F2G16X0M) :  (64K + 2K)Word
Page Read Operation
    - Page Size
    - X8   device(K9F2G08X0M) :  2K-Byte
    - X16 device(K9F2G16X0M) : 1K-Word
    - Random Read : 25ms(Max.)
    - Serial  Access : 50ns(Min.)
                            30ns(Min., K9F2G08U0M only)
Fast Write Cycle Time
    - Page Program time : 300ms(Typ.)
    - Block Erase Time : 2ms(Typ.)
Command/Address/Data Multiplexed I/O Port
Hardware Data Protection
    - Program/Erase Lockout During Power Transitions
Reliable CMOS Floating-Gate Technology
    - Endurance : 100K Program/Erase Cycles
    - Data Retention : 10 Years
Command Register Operation
Cache Program Operation for High Performance Program
Power-On Auto-Read Operation
Intelligent Copy-Back Operation
Unique ID for Copyright Protection Package :
    - K9F2GXXX0M-YCB0/YIB0
    48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
    - K9F2GXXX0M-PCB0/PIB0 : Pb-FREE PACKAGE
    48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)

K9F2G08U0M Connection Diagram

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