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K9K2G08Q0M, K9K2G08Q0M-YIB0, K9K2G08QOM-PCBO

K9K2G08Q0M, K9K2G08Q0M-YIB0, K9K2G08QOM-PCBO Selling Leads, Datasheet

MFG:SAMSUNG  Package Cooled:TSOP  D/C:05+

K9K2G08Q0M, K9K2G08Q0M-YIB0, K9K2G08QOM-PCBO Picture

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Part Number: K9K2G08Q0M

 

MFG: SAMSUNG

Package Cooled: TSOP

D/C: 05+

 

 

 
 
 
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  • K9K1208UOC-DIBO

  • Vendor: SAMES D/C: 05+& Qty: 561  Adddate: 2024-03-28
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  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
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  • K9K1G08UOA-YCBO

  • Vendor: SAMES D/C: 03+& Qty: 198  Adddate: 2024-03-28
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  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
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About K9K2G08Q0M

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Datasheet: K9K2G08Q0M

File Size: 657045 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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  • K9K1208UOC-DIBO

  • Vendor: SAMES D/C: 05+& Qty: 561  Adddate: 2024-03-28
  • Inquire Now
  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
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  • K9K1G08UOA-YCBO

  • Vendor: SAMES D/C: 03+& Qty: 198  Adddate: 2024-03-28
  • Inquire Now
  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
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About K9K1208D0C

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Datasheet: K9K1208D0C

File Size: 976684 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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K9K2G08QOM-PCBO Suppliers

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  • K9K1208UOC-DIBO

  • Vendor: SAMES D/C: 05+& Qty: 561  Adddate: 2024-03-28
  • Inquire Now
  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
    (5)
  • K9K1G08UOA-YCBO

  • Vendor: SAMES D/C: 03+& Qty: 198  Adddate: 2024-03-28
  • Inquire Now
  • ASK SEMICONDUCTOR LTD   China
    Contact: Mr.Subaninfo@asksemi.com   MSN:asksemiconductor@hotmail.com
    Tel: 86-0755-33060075/0755-29183325/0755-83221176
    Fax: 86-0755-33060076
    (5)

About K9K1208D0C

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Datasheet: K9K1208D0C

File Size: 976684 KB

Manufacturer: SAMSUNG [Samsung semiconductor]

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K9K2G08Q0M General Description

Offered in 256Mx8bit or 128Mx16bit, the K9K2GXXX0M is 2G bit with spare 64M bit capacity. Its NAND cell provides the most costeffective  solution for the solid state mass storage market. A program operation can be performed in typical 300s on the 2112-byte(X8 device) or 1056-word(X16 device) page and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) or 64Kword( X16 device) block. Data in the data page can be read out at 80ns(1.8V device) or 50ns(3.3V device) cycle time per byte(X8 device) or word(X16 device). The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9K2GXXX0Ms extended reliability of 100K program/ erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9K2GXXX0M is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility. An ultra high density solution having two 2Gb stacked with two chip selects is also available in standard TSOPI package.

K9K2G08Q0M Maximum Ratings

Parameter Symbol
Rating
Unit
K9K2GXXQ0M(1.8V)
K9XXGXXUXM(3.3V)
Voltage on any pin relative to VSS VIN/OUT
-0.6 to + 2.45
-0.6 to + 4.6
V
VCC
-0.2 to + 2.45
-0.6 to + 4.6
Temperature Under Bias K9XXGXXXXM-XCB0 TBIAS
-10 to +125
K9XXGXXXXM-XIB0
-40 to +125
Storage Temperature K9XXGXXXXM-XCB0 TSTG
-65 to +150
K9XXGXXXXM-XIB0
Short Circuit Current IOS
5
mA
NOTE :
1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns. Maximum DC voltage on input/output pins is VCC,+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.
2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

K9K2G08Q0M Features

• Voltage Supply
   -1.8V device(K9K2GXXQ0M): 1.7V~1.95V
   -3.3V device(K9XXGXXUXM): 2.7 V ~3.6 V
• Organization
   - Memory Cell Array
   -X8 device(K9K2G08X0M) : (256M + 8,192K)bit x 8bit
   -X16 device(K9K2G16X0M) : (128M + 4,096K)bit x 16bit
   - Data Register
   -X8 device(K9K2G08X0M): (2K + 64)bit x8bit
   -X16 device(K9K2G16X0M): (1K + 32)bit x16bit
   - Cache Register
   -X8 device(K9K2G08X0M): (2K + 64)bit x8bit
   -X16 device(K9K2G16X0M): (1K + 32)bit x16bit
• Automatic Program and Erase
   - Page Program
   -X8 device(K9K2G08X0M): (2K + 64)Byte
   -X16 device(K9K2G16X0M): (1K + 32)Word
   - Block Erase
   -X8 device(K9K2G08X0M): (128K + 4K)Byte
   -X16 device(K9K2G16X0M): (64K + 2K)Word
• Page Read Operation
   - Page Size
   - X8 device(K9K2G08X0M): 2K-Byte
   - X16 device(K9K2G16X0M) : 1K-Word
   - Random Read : 25s(Max.)
   - Serial Access
     1.8V device(K9K2GXXQ0M): 80ns(Min.)
     3.3V device(K9XXGXXUXM): 50ns(Min.)
     256M x 8 Bit / 128M x 16 Bit NAND Flash Memory
• Fast Write Cycle Time
   - Program time : 300s(Typ.)
   - Block Erase Time : 2ms(Typ.)
• Command/Address/Data Multiplexed I/O Port
• Hardware Data Protection
   - Program/Erase Lockout During Power Transitions
• Reliable CMOS Floating-Gate Technology
   - Endurance : 100K Program/Erase Cycles
   - Data Retention : 10 Years
• Command Register Operation
• Cache Program Operation for High Performance Program
• Power-On Auto-Read Operation
• Intelligent Copy-Back Operation
• Unique ID for Copyright Protection
• Package :
   - K9K2GXXX0M-YCB0/YIB0
     48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
   - K9K2G08U0M-VCB0/VIB0
     48 - Pin WSOP I (12X17X0.7mm)
   - K9K2GXXX0M-PCB0/PIB0
     48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)- Pb-free Package
   - K9K2G08U0M-FCB0/FIB0
      48 - Pin WSOP I (12X17X0.7mm)- Pb-free Package
     * K9K2G08U0M-V,F(WSOPI ) is the same device as
     K9K2G08U0M-Y,P(TSOP1) except package type.
   - K9W4GXXU1M-YCB0,PCB0/YIB0,PIB0 : Two K9K2G08U0M stacked.
     48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
   - K9W4GXXU1M-KCB0,ECB0/KIB0,EIB0 : Two K9K2G08U0M stacked.
     48 - Pin TSOP I (12 x 17 / 0.5 mm pitch)

K9K2G08Q0M Connection Diagram

K9K2G08Q0M-YIB0 General Description

Offered in 128Mx8bit or 64Mx16bit, the K9F1GXXX0M is 1G bit with spare 32M bit capacity. Its NAND cell provides the most costeffective solution for the solid state mass storage market. A program operation can be performed in typical 300ms on the 2112-byte(X8 device) or 1056-word(X16 device) page and an erase operation can be perfor-med in typical 2ms on a 128K-byte(X8 device) or 64K-word(X16 device) block. Data in the data page can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as com-mand input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take
advantage of the K9F1GXXX0M¢s extended reliability of 100K program/erase cycles by providing ECC(Error Cor-recting Code) with real time mapping-out algorithm. The K9F1GXXX0M is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.

K9K2G08Q0M-YIB0 Features

· Voltage Supply
-1.8V device(K9F1GXXQ0M): 1.70V~1.95V
-3.3V device(K9F1GXXU0M): 2.7 V ~3.6 V
· Organization
- Memory Cell Array
-X8 device(K9F1G08X0M) : (128M + 4,096K)bit x 8bit
-X16 device(K9F1G16X0M) : (64M + 2,048K)bit x 16bit
- Data Register
-X8 device(K9F1G08X0M): (2K + 64)bit x8bit
-X16 device(K9F1G16X0M): (1K + 32)bit x16bit
- Cache Register
-X8 device(K9F1G08X0M): (2K + 64)bit x8bit
-X16 device(K9F1G16X0M): (1K + 32)bit x16bit
· Automatic Program and Erase
- Page Program
-X8 device(K9F1G08X0M): (2K + 64)Byte
-X16 device(K9F1G16X0M): (1K + 32)Word
- Block Erase
-X8 device(K9F1G08X0M): (128K + 4K)Byte
-X16 device(K9F1G16X0M): (64K + 2K)Word
· Page Read Operation
- Page Size
- X8 device(K9F1G08X0M): 2K-Byte
- X16 device(K9F1G16X0M) : 1K-Word
- Random Read : 25ms(Max.)
- Serial Access : 50ns(Min.)
· Fast Write Cycle Time
- Program time : 300ms(Typ.)
- Block Erase Time : 2ms(Typ.)
· Command/Address/Data Multiplexed I/O Port
· Hardware Data Protection
- Program/Erase Lockout During Power Transitions
· Reliable CMOS Floating-Gate Technology
- Endurance : 100K Program/Erase Cycles
- Data Retention : 10 Years
· Command Register Operation
· Cache Program Operation for High Performance Program
· Power-On Auto-Read Operation
· Intelligent Copy-Back Operation
· Unique ID for Copyright Protection
· Package :
- K9F1GXXX0M-YCB0/YIB0
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9F1G08U0M-VCB0/VIB0
  48 - Pin WSOP I (12X17X0.7mm)
- K9F1GXXX0M-PCB0/PIB0
  48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)- Pb-free Package
- K9F1G08U0M-FCB0/FIB0
  48 - Pin WSOP I (12X17X0.7mm)- Pb-free Package
* K9F1G08U0M-V,F(WSOPI ) is the same device as
   K9F1G08U0M-Y,P(TSOP1) except package type.

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