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MA4SPS421, MA4SPS422, MA4SPS502

MA4SPS421, MA4SPS422, MA4SPS502 Selling Leads, Datasheet

MFG:M/A-COM  Package Cooled:N/A  D/C:N/A

MA4SPS421, MA4SPS422, MA4SPS502 Picture

MA4SPS421, MA4SPS422, MA4SPS502 Datasheet download

Five Points

Part Number: MA4SPS421

 

MFG: M/A-COM

Package Cooled: N/A

D/C: N/A

 

 

 
 
 
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MA4SPS421 Suppliers

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  • MA4SPS421

  • Vendor: M/A-COM Technology Solutions Pack: N/A D/C: 11+/12+& Qty: 8354 Note: M/A-COM Technology Solutions  Adddate: 2026-07-10
  • Inquire Now
  • Yashen(HK)Electronics Co.,Limited   China
    Contact: Mr.ChenWei Hai   MSN:yashen.ic@hotmail.com
    Tel: 86-0755-83611575
    Fax: 86-0755-83612186
    (25)

About MA4000

PDF/DataSheet Download

Datasheet: MA4000

File Size: 73791 KB

Manufacturer: PANASONIC [Panasonic Semiconductor]

Download : Click here to Download

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MA4SPS422 Suppliers

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  • MA4SPS422

  • Vendor: M/A-COM Technology Solutions Pack: N/A D/C: 11+/12+& Qty: 8355 Note: M/A-COM Technology Solutions  Adddate: 2026-07-10
  • Inquire Now
  • Yashen(HK)Electronics Co.,Limited   China
    Contact: Mr.ChenWei Hai   MSN:yashen.ic@hotmail.com
    Tel: 86-0755-83611575
    Fax: 86-0755-83612186
    (25)

About MA4000

PDF/DataSheet Download

Datasheet: MA4000

File Size: 73791 KB

Manufacturer: PANASONIC [Panasonic Semiconductor]

Download : Click here to Download

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MA4SPS502 Suppliers

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  • MA4SPS502

  • Vendor: M/A-COM Technology Solutions Pack: N/A D/C: 11+/12+& Qty: 8356 Note: M/A-COM Technology Solutions  Adddate: 2026-07-10
  • Inquire Now
  • Yashen(HK)Electronics Co.,Limited   China
    Contact: Mr.ChenWei Hai   MSN:yashen.ic@hotmail.com
    Tel: 86-0755-83611575
    Fax: 86-0755-83612186
    (25)

About MA4SPS502

PDF/DataSheet Download

Datasheet: MA4SPS502

File Size: 129598 KB

Manufacturer: MACOM [Tyco Electronics]

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MA4SPS502 General Description

This device is a silicon-glass PIN diode chip fabricated with M/A-COM's patented HMICÔ process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.

MA4SPS502 Maximum Ratings

Parameter Absolute Maximum
Reverse Voltage
Forward Current
Operating Temperature
Storage Temperature
Dissipated Power (RF & DC)
Mounting Temperature
-300 V
600 mA
-65 °C to +150 °C
-65 °C to +150 °C
2 W
+235 °C for 10 seconds
1. Exceeding these limits may cause permanent damage.

MA4SPS502 Features

·Surface Mount Device
· No Wirebonds Required
· Rugged Silicon-Glass Construction
· Silicon Nitride Passivation
·Polymer Scratch Protection
·Low Parasitic Capacitance and Inductance
· High Power Handling (Efficient Heatsinking)

MA4SPS502 Typical Application

These packageless devices are suitable for usage in moderate incident power (10 W C.W.) or higher incident peak power (500 W) series, shunt, or series-shunt switches. Small parasitic inductance, 0.35 nH, and excellent RC time constant, 0.22 pS, make the devices ideal for wireless TR switch and accessory switch circuits, where higher P1dB and IP3 values are required.

These diodes can also be used in p, T, tapered resistance, and switched-pad attenuator control circuits for 50 or 75  systems.

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