MAX970CSD, MAX9710, MAX9710E Selling Leads, Datasheet
MFG:MAX Package Cooled:www.dayue-hk.com D/C:09+ ROHS
MAX970CSD, MAX9710, MAX9710E Datasheet download

Part Number: MAX970CSD
MFG: MAX
Package Cooled: www.dayue-hk.com
D/C: 09+ ROHS
MFG:MAX Package Cooled:www.dayue-hk.com D/C:09+ ROHS
MAX970CSD, MAX9710, MAX9710E Datasheet download

MFG: MAX
Package Cooled: www.dayue-hk.com
D/C: 09+ ROHS
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PDF/DataSheet Download
Datasheet: MAX002
File Size: 42133 KB
Manufacturer: FILTRONIC [Filtronic Compound Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MAX9710
File Size: 621117 KB
Manufacturer: MAXIM [Maxim Integrated Products]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MAX9710ETP
File Size: 621117 KB
Manufacturer: MAXIM [Maxim Integrated Products]
Download : Click here to Download
The MAX9710/MAX9711 are stereo/mono 3W bridge-tied load (BTL) audio power amplifiers. These devices are PC99/01 compliant, operate from a single 4.5V to 5.5V supply, and feature an industry-leading 100dB PSRR, which allows these devices to operate from noisy supplies without additional, costly power-supply conditioning. An ultra-low 0.005% THD+N ensures clean, low-distortion amplification of the audio signal while patented click-and-pop suppression eliminates audible transients on power and shutdown cycles. Power-saving features include low 2mV VOS (minimizing DC current drain through the speakers), low 7mA supply current, and a 0.5A shutdown mode. A MUTE function allows the outputs to be quickly enabled or disabled.
These devices include thermal overload protection, are specified over the extended -40°C to +85°C temperature range, and are supplied in thermally efficient packages. The MAX9710 is available in either a 20-pin thin QFN package (5mm ✕ 5mm ✕ 0.8mm) or a 16-pin TSSOP-EP package. The MAX9711 is available in a 12- pin thin QFN package (4mm ✕ 4mm ✕ 0.8mm).
VDD to GND, PGND .............................................................+6V
PVDD to VDD ..................................................................±0.3V
PGND to GND...................................................................±0.3V
All Other Pins to GND...............................-0.3V to (VDD + 0.3V)
Continuous Input Current (into any pin
except power supply and output pins).........................±20mA
Continuous Power Dissipation (TA = +70°C)
12-Pin Thin QFN (derate 16.9mW/°C above +70°C) ..1349mW
16-Pin TSSOP-EP (derate 21.3mW/°C above +70°C)..1702mW
20-Pin Thin QFN (derate 20.8mW/°C above +70°C) ...1667mW
Operating Temperature Range.........................-40°C to +85°C
Storage Temperature Range ..........................-65°C to +150°C
Junction Temperature .....................................................+150°C
Lead Temperature (soldering, 10s) ................................+300°C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

