Package Cooled:SOP16 D/C:04+
Info of NDM3001 | Info of NDM60-48S05T2/W | Info of NDM6060-030E
Package Cooled: SOP16
D/C: 04+
MFG: NS Package Cooled: SOP16 D/C: 04+ Qty: 60 Note: STOCK
HONGKONG WILWIN TECHNOLOGY LIMITED 
Tel: 86-755-82976956
Adddate: 2010-03-12
MFG: NS Package Cooled: SOP16 D/C: 08+ Qty: 300
Contact: Ms.Melissa
Tel: 86-755-83005250
Adddate: 2010-03-12
MFG: NSC Qty: 20 Note: RFQ,CALL FOR PRICE
Grand Parts Electronics Corporation 
Contact: Mr.Marco
Tel: 86-755-8281-4478
Adddate: 2010-03-12
MFG: NS Package Cooled: SOP D/C: 60
Tel: 86-0755-83610826
Adddate: 2010-03-12
MFG: NSC Package Cooled: SOP-16 D/C: 2008+ Qty: 20
Tel: 886-0755-83331339
Adddate: 2010-03-12
MFG: FSC Package Cooled: 06+ D/C: 500
HONGCHUANGXING ELECTRONICS CO.LTD 
Tel: 86-86-33279575
Adddate: 2010-03-12
MFG: NS Package Cooled: 06+ D/C: 500
HONGCHUANGXING ELECTRONICS CO.LTD 
Tel: 86-86-33279575
Adddate: 2010-03-12
PDF/DataSheet Download
Datasheet: NDM3001
File Size: 256990 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
D/C: 2007+ Qty: 1 Note: STOCK
HONGKONG WILWIN TECHNOLOGY LIMITED 
Tel: 86-755-82976956
Adddate: 2010-03-12
MFG: n/a Package Cooled: 模块 D/C: 05+ Qty: 112 Note: new and original stock!
Minshunxin Electronics Co.,LTD. 
Tel: 86-755-82579485
Adddate: 2010-03-12
Qty: 10 Note: in stock
Tord Electronics(hk) Co., Limited 
Tel: 86-755-82811283
Adddate: 2010-03-12
MFG: FSC Package Cooled: 06+ D/C: 500
HONGCHUANGXING ELECTRONICS CO.LTD 
Tel: 86-86-33279575
Adddate: 2010-03-12
MFG: NS Package Cooled: 06+ D/C: 500
HONGCHUANGXING ELECTRONICS CO.LTD 
Tel: 86-86-33279575
Adddate: 2010-03-12
MFG: HARRIS Package Cooled: SOP D/C: 98 Qty: 3500
Contact: Ms.Wang Jingjing
Tel: 86-27-88720312
Adddate: 2010-03-12
MFG: SOP Package Cooled: NS D/C: 03+ Qty: 3156 Note: http://www.silicon-ic.com
SILICON TECHNOLOGY(HONGKONG)ELECTRONIC LIMITED 
Tel: 86-755-83000558
Adddate: 2010-03-12
PDF/DataSheet Download
Datasheet: NDM3000
File Size: 252582 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
MFG: HK Package Cooled: PLCC Qty: 1450 Note: http://www.silicon-ic.com
SILICON TECHNOLOGY(HONGKONG)ELECTRONIC LIMITED 
Tel: 86-755-83000558
Adddate: 2010-03-12
MFG: 15 Package Cooled: HK D/C: N/A
Tel: 86-755-83994412
Adddate: 2010-03-12
MFG: Artesyn D/C: 09+ Qty: 1000 Note: 3-4 weeks
Tel: 86-027-86966790
Adddate: 2010-03-12
MFG: artesyn Package Cooled: NEW & ORG Qty: 58
Tel: 86-21-56052800
Adddate: 2010-03-12
Tel: +-852-81913181
Adddate: 2010-03-12
MFG: FSC Package Cooled: 06+ D/C: 500
HONGCHUANGXING ELECTRONICS CO.LTD 
Tel: 86-86-33279575
Adddate: 2010-03-12
MFG: NS Package Cooled: 06+ D/C: 500
HONGCHUANGXING ELECTRONICS CO.LTD 
Tel: 86-86-33279575
Adddate: 2010-03-12
PDF/DataSheet Download
Datasheet: NDM3000
File Size: 252582 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
The NDM3001 three phase brushless motor driver consists of three N-Channel and P-Channel MOSFETs in a half bridge configuration. These devices are produced using Fairchild’s proprietary, high cell density DMOS technology. This very high density process is tailored to minimize on-state resistance which reduces power loss, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage 3 phase motor driver such as disk drive spindle motor control and other half bridge applications.
|
Symbol |
Parameter |
NDM3000 |
Units | |
|
VDSS VGSS |
Drain-Source Voltage (All Types) Gate-Source Voltage (All Types) |
±30 ±20 ±2.9 ±10 2.5 1.6 1.4 -55 to 150 |
V V A W °C | |
|
ID |
Drain Current Q1+Q4 or Q1+Q6 or Q3+Q2 - Continuous Q3+Q6 or Q5+Q2 or Q5+Q4– Pulsed |
(Note 1a & 2) | ||
|
PD |
Total Power Dissipation Q1+Q4 or Q1+Q6 or Q3+Q2 or Q3+Q6 or Q5+Q2 or Q5+Q4 |
(Note 1a) (Note 1b) (Note 1c) | ||
| TJ,TSTG | Operating and Storage Temperature Range | |||
· ±2.9 A, ±30 V, 2.5W
· High density cell design for extremely low RDS(ON).
· High power and current handling capability.
· Industry standard SOIC-16 surface mount package.