PACDN1408, PACDN1416C, PACDN2416C Selling Leads, Datasheet
MFG:CMD Package Cooled:SMD D/C:04+
PACDN1408, PACDN1416C, PACDN2416C Datasheet download
Part Number: PACDN1408
MFG: CMD
Package Cooled: SMD
D/C: 04+
PACDN1408, PACDN1416C, PACDN2416C
- Table of contents:
Info of PACDN1408
Info of PACDN1416C
Info of PACDN2416C
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About PACDN1408C
PDF/DataSheet Download
Datasheet: PACDN1408C
File Size: 765241 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
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About PACDN1416C
PDF/DataSheet Download
Datasheet: PACDN1416C
File Size: 52749 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
Download : Click here to Download
About PACDN2416C
PDF/DataSheet Download
Datasheet: PACDN2416C
File Size: 53558 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
Download : Click here to Download
PACDN1408 General Description
The PACDN1404 and PACDN1408 are 4 and 8 channel transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.
These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge). All I/Os are rated at ±25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30kV.
The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The PACDN1404 and PACDN1408 are available with RoHS compliant lead-free finishing.
PACDN1408 Maximum Ratings
- 4 or 8 transient voltage suppressors in a single package
- In-system Electrostatic Discharge (ESD) protection to ±25kV contact discharge per IEC 61000-4-2 international standard
- Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
- RoHS compliant (lead-free) finishing
PACDN1416C General Description
The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.
These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maxi- mum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharg to greater than 30kV.
The Chip Scale Package format of these devices enab extremely small footprints that are necessary in portab electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the us of underfill.
PACDN1416C Features
·4, 8, or 16 transient voltage suppressors in a single package
·In-system Electrostatic Discharge (ESD) protection to 25kV contact discharge per IEC 61000-4-2 international standard
·Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
PACDN1416C Typical Application
·ESD protection of I/O port connections, such as cellular phone, PDA, internet appliance and PC ports
·Protection of interface ports or IC pins which are exposed to high levels of ESD
·Protection of interface ports or IC pins which are exposed to high levels of ESD
PACDN2416C General Description
The PACDN2404C, PACDN2408C and PACDN2416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to- back zener connections provide ESD protection in cases where nodes with AC signals are present.
These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maxi- mum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30kV.
The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill.
PACDN2416C Features
·4, 8, or 16 transient voltage suppressors in a single package
·In-system Electrostatic Discharge (ESD) protection to 18kV contact discharge per IEC 61000-4-2 international standard
·Compact Chip Scale Package (0.65mm pitch) forma saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
PACDN2416C Typical Application
·ESD protection of I/O port connections, such as cellular phone, PDA, internet appliance and PC ports
·Protection of interface ports or IC pins which are exposed to high levels of ESD
·ESD protection of analog video and audio R, L, V (right, left, video) ports
·Protection of interface ports or IC pins which are exposed to high levels of ESD
·ESD protection of analog video and audio R, L, V (right, left, video) ports
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