S1A-E3/61T, S1A-F, S1AL Selling Leads, Datasheet
MFG:VISHAY Package Cooled:DO-214A D/C:09+
S1A-E3/61T, S1A-F, S1AL Datasheet download
Part Number: S1A-E3/61T
MFG: VISHAY
Package Cooled: DO-214A
D/C: 09+
S1A-E3/61T, S1A-F, S1AL
- Table of contents:
Info of S1A-E3/61T
Info of S1A-F
Info of S1AL
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About S1A
PDF/DataSheet Download
Datasheet: S1A
File Size: 49554 KB
Manufacturer: FAIRCHILD
Download : Click here to Download
About S1A
PDF/DataSheet Download
Datasheet: S1A
File Size: 49554 KB
Manufacturer: FAIRCHILD
Download : Click here to Download
About S1AL
PDF/DataSheet Download
Datasheet: S1AL
File Size: 50432 KB
Manufacturer: TSC [Taiwan Semiconductor Company, Ltd]
Download : Click here to Download
S1AL Maximum Ratings
|
Type Number |
Symbol |
S1AL |
S1BL |
S1DL |
S1GL |
S1JL |
S1kL |
S1ML |
Units |
| Maximum Recurrent Peak Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
| Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
V |
| Maximum DC Blocking Voltage |
VDC |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
| Marking Code (Note 3) |
11LYM |
1BLYM |
1DLYM |
1GLYM |
1JLYM |
1KLYM |
1MLYM |
||
| Maximum Average Forward Rectified Current @TL =110 |
I(AV) |
1.0 |
A | ||||||
| Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) |
IFSM |
30 |
A | ||||||
| Maximum Instantaneous Forward Voltage @ 1.0A |
VF |
1.1 |
V | ||||||
| Maximum DC Reverse Current @ TA =25 at Rated DC Blocking Voltage @ TA=125 |
IR |
5 50 |
uA uA | ||||||
| Typical Thermal Resis tance (Note 2) |
RJL RJA |
25 85 |
30 85 |
/W | |||||
| Typical Junction Capacitance ( Note 1 ) |
CJ |
9 |
PF | ||||||
| Operating Temperature Range |
Tj |
-55 to +150 |
|||||||
| Storage Temperature Range |
TSTG |
-55 to +150 |
|||||||
S1AL Features
·For surface mounted application
· Glass passivated junction chip.
· ow-PROFILE PACKAGE
· Ideal for automated placement
· Low power loss, high efficiency
· High temperature soldering:260oC / 10 seconds at terminals
· Glass passivated junction chip.
· ow-PROFILE PACKAGE
· Ideal for automated placement
· Low power loss, high efficiency
· High temperature soldering:260oC / 10 seconds at terminals
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