SB1080DC-T3, SB108V04, SB10H150CT-1 Selling Leads, Datasheet
MFG:S Package Cooled:TO- D/C:05/06
SB1080DC-T3, SB108V04, SB10H150CT-1 Datasheet download
Part Number: SB1080DC-T3
MFG: S
Package Cooled: TO-
D/C: 05/06
SB1080DC-T3, SB108V04, SB10H150CT-1
- Table of contents:
Info of SB1080DC-T3
Info of SB108V04
Info of SB10H150CT-1
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About SB1080DC-T3
PDF/DataSheet Download
Datasheet: SB1080DC-T3
File Size: 47444 KB
Manufacturer: WTE [Won-Top Electronics]
Download : Click here to Download
About SB100-05H
PDF/DataSheet Download
Datasheet: SB100-05H
File Size: 87725 KB
Manufacturer: SANYO [Sanyo Semicon Device]
Download : Click here to Download
About SB100-05H
PDF/DataSheet Download
Datasheet: SB100-05H
File Size: 87725 KB
Manufacturer: SANYO [Sanyo Semicon Device]
Download : Click here to Download
SB10H150CT-1 General Description
MBR10H150CT, MBRF10H150CT, SB10H150CT-1 datasheet
SB10H150CT-1 Maximum Ratings
| PARAMETER |
SYMBOL |
MBR10H150CT |
UNIT |
| Maximum repetitive peak reverse voltage |
VRRM |
150 |
V |
| Working peak reverse voltage |
VRWM |
150 |
V |
| Maximum DC blocking voltage |
VDC |
150 |
V |
| Maximum average forward rectified current(see Fig.1)Total device per diode |
IF(AV) |
10 5 |
A |
| Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load per diode |
IFSM |
160 |
A |
| Peak repetitive reverse current per diode at tp= 2s,1kHz |
IRRM |
1.0 |
A |
| Peak non-repetitive reverse surge energy per diode (8/20s waveform) |
ERSM |
10 |
mJ |
| Non-repetitive avalanche energy per diode at 25, IAS=1.5A, L=10mH |
EAS |
11.25 |
mJ |
| Voltage rate of change (rated VR ) |
dv/dt |
10000 |
V/s |
| Operating junction and storage temperature range |
TJ , TSTG |
-65 to +175 |
|
| Isolation voltage (ITO-220AB only) From terminals to heatsink t =1minute |
VAC |
1500 |
V |
SB10H150CT-1 Features
`Guardring for overvoltage protection
`Low power loss, high efficiency
`Low forward voltage drop
`High frequency operation
`Solder dip 260, 40 second
`Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
`Low power loss, high efficiency
`Low forward voltage drop
`High frequency operation
`Solder dip 260, 40 second
`Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
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