MFG:SGMICRO Package Cooled:SOT-343 D/C:926
SGM2007-3.3XN5/TR, SGM2013, SGM2013_3.0XN5 Datasheet download
MFG: SGMICRO
Package Cooled: SOT-343
D/C: 926
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PDF/DataSheet Download
Datasheet: SGM2005-3.0YD6/TR
File Size: 538484 KB
Manufacturer: SGMICRO [Shengbang Microelectronics Co, Ltd]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SGM2013
File Size: 56211 KB
Manufacturer: SONY [Sony Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SGM2005-3.0YD6/TR
File Size: 538484 KB
Manufacturer: SGMICRO [Shengbang Microelectronics Co, Ltd]
Download : Click here to Download
The SGM2013 low-power, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 300mA. They are perfect choice for low voltage, low power applications. An ultra low ground current (200A at 300mA output) makes them attractive for battery operated power systems. The SGM2013 series also offer ultra low dropout voltage (300mV at 300mA output) to prolong battery life in portable electronics The output voltage is preset to voltages in the range of 1.8V to 3.3V. Other features include foldback current limit and thermal shut-down protection.
SGM2013 come in 3-pin SOT23 and 3-pin SOT89 package.
IN to GND.....................................................................- 0.3V to +6V
Output Short-Circuit Duration............................................Infinite
OUT to GND...................................................- 0.3V to (VIN + 0.3V)
Power Dissipation, PD @ TA = 25
SOT23-3 .....................................................................................0.4W
SOT89-3 ................................................................................0.571W
Package Thermal Resistance
SOT23-3, JA....................................................................... 250/W
SOT89-3, JA.........................................................................175°C/W
Operating Temperature Range................. ..........- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Lead Temperature (soldering, 10s).......................................260°C
ESD Susceptibility
HBM..........................................................................................4000V
MM..............................................................................................400V
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating onditions for extended periods may affect device reliability.
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