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SI5479DUT1E3, SI5499DCT1E3, SI5504DC

SI5479DUT1E3, SI5499DCT1E3, SI5504DC Selling Leads, Datasheet

MFG:sil  Package Cooled:sil  D/C:dc0549

SI5479DUT1E3, SI5499DCT1E3, SI5504DC Picture

SI5479DUT1E3, SI5499DCT1E3, SI5504DC Datasheet download

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Part Number: SI5479DUT1E3

 

MFG: sil

Package Cooled: sil

D/C: dc0549

 

 

 
 
 
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SI5479DUT1E3 Suppliers

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  • SI5321GBC

  • Pack: SIL  Adddate: 2024-04-29
  • Inquire Now
  • NEW ELITE GROUP   China
    Contact: Mr.arteinchow  
    Tel: 086-0755-83279898-1166
    Fax: 086-0755-83279502
    (1)

About SI5010

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Datasheet: SI5010

File Size: 289324 KB

Manufacturer: ETC [ETC]

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SI5499DCT1E3 Suppliers

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  • SI5321GBC

  • Pack: SIL  Adddate: 2024-04-29
  • Inquire Now
  • NEW ELITE GROUP   China
    Contact: Mr.arteinchow  
    Tel: 086-0755-83279898-1166
    Fax: 086-0755-83279502
    (1)

About SI5010

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Datasheet: SI5010

File Size: 289324 KB

Manufacturer: ETC [ETC]

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SI5504DC Suppliers

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  • SI5504DC-T1

  • Vendor: Vishay Pack: SOP Qty: 2600 Note: EA4A  Adddate: 2024-04-29
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  • Yuexunfa Electronics   China
    Contact: Ms.linlinda   MSN:yanxuan5299@hotmail.com
    Tel: 86-755-83778358
    Fax: 86-755-83778378
    (18)

About Si5504DC

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Datasheet: Si5504DC

File Size: 66806 KB

Manufacturer: VISAY [Vishay Siliconix]

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SI5504DC Maximum Ratings

Parameter Symbol Channel-1 Channel-2 Unit
5 secs Steady State 5 secs Steady State
Drain-Source Voltage VDS 30 -30 V
Gate-Source Voltage VGS ±20 ±20
Continuous Drain Current (TJ = 150)a TA = 25 ID ±3.9 ±2.9 ±2.8 ±2.1 A
TA = 85 ±2.8 ±2.1 ±2.0 ±1.5
Continuous Source Current (Diode Conduction)a IS 1.8 0.9 -1.8 -0.9
Pulsed Drain Current IDM ±10 ±10
Maximum Power Dissipationa TA = 25 PD 2.1 1.1 2.1 1.1 W
TA = 85 1.1 0.6 1.1 0.6
Operating Junction and Storage Temperature Range TJ, Tstg -55 to 150
Soldering Recommendations (Peak Temperature)b, c   260

Notes
a. Surface Mounted on 1" x 1" FR4 Board.
b. See Reliability Manual for profile. The ChipFET/PowerPAK is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

SI5504DC Connection Diagram

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