SI5479DUT1E3, SI5499DCT1E3, SI5504DC Selling Leads, Datasheet
MFG:sil Package Cooled:sil D/C:dc0549
SI5479DUT1E3, SI5499DCT1E3, SI5504DC Datasheet download
Part Number: SI5479DUT1E3
MFG: sil
Package Cooled: sil
D/C: dc0549
MFG:sil Package Cooled:sil D/C:dc0549
SI5479DUT1E3, SI5499DCT1E3, SI5504DC Datasheet download
MFG: sil
Package Cooled: sil
D/C: dc0549
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PDF/DataSheet Download
Datasheet: SI5010
File Size: 289324 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SI5010
File Size: 289324 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: Si5504DC
File Size: 66806 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
Parameter | Symbol | Channel-1 | Channel-2 | Unit | |||
5 secs | Steady State | 5 secs | Steady State | ||||
Drain-Source Voltage | VDS | 30 | -30 | V | |||
Gate-Source Voltage | VGS | ±20 | ±20 | ||||
Continuous Drain Current (TJ = 150)a | TA = 25 | ID | ±3.9 | ±2.9 | ±2.8 | ±2.1 | A |
TA = 85 | ±2.8 | ±2.1 | ±2.0 | ±1.5 | |||
Continuous Source Current (Diode Conduction)a | IS | 1.8 | 0.9 | -1.8 | -0.9 | ||
Pulsed Drain Current | IDM | ±10 | ±10 | ||||
Maximum Power Dissipationa | TA = 25 | PD | 2.1 | 1.1 | 2.1 | 1.1 | W |
TA = 85 | 1.1 | 0.6 | 1.1 | 0.6 | |||
Operating Junction and Storage Temperature Range | TJ, Tstg | -55 to 150 | |||||
Soldering Recommendations (Peak Temperature)b, c | 260 |
Notes
a. Surface Mounted on 1" x 1" FR4 Board.
b. See Reliability Manual for profile. The ChipFET/PowerPAK is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.