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Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C Derate above 25°C Thermal Resistance Junction to Ambient
PD
RJA
225 1.8 556
mW° mW/°C °C/W
Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C Derate above 25°C Thermal Resistance Junction−to−Ambient
PD
RJA
300 2.4 417
mW° mW/°C °C/W
Junction and Storage Temperature Range
TJ,Tstg
− 55 to +150
°C
Lead Solder Temperature − Maximum (10 Second Duration)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non−repetitive current pulse per Figure 2 2. FR−5 = 1.0 x 0.75 x 0.62 in. 3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
SL05T1 Features
• TVS Diode in Series with a Compensating Diode Offers <5 pF Capacitance • ESD Protection Meeting IEC 61000−4−2, 4−4, 4−5 • Peak Power Rating of 300 W, 8 * 20 s • Bi−Direction Protection Can Be Achieved By Using Two Devices • Flammability Rating UL 94 V−0 • Pb−Free Packages are Available