SMP16LC6.5, SMP18, SMP18E Selling Leads, Datasheet
MFG:MSC Package Cooled:SOP16P D/C:00+
SMP16LC6.5, SMP18, SMP18E Datasheet download

Part Number: SMP16LC6.5
MFG: MSC
Package Cooled: SOP16P
D/C: 00+
MFG:MSC Package Cooled:SOP16P D/C:00+
SMP16LC6.5, SMP18, SMP18E Datasheet download

MFG: MSC
Package Cooled: SOP16P
D/C: 00+
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PDF/DataSheet Download
Datasheet: SMP-03
File Size: 165085 KB
Manufacturer: RFM [RF Monolithics, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SMP18
File Size: 275527 KB
Manufacturer: AD [Analog Devices]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SMP-03
File Size: 165085 KB
Manufacturer: RFM [RF Monolithics, Inc]
Download : Click here to Download
The SMP18 is a monolithic octal sample-and-hold; it has eight internal buffer amplifiers, input multiplexer, and internal hold capacitors. It is manufactured in an advanced oxide isolated CMOS technology to obtain high accuracy, low droop rate, and fast acquisition time. The SMP18 has a typical linearity error of only 0.01% and can accurately acquire a 10-bit input signal to ±1/2 LSB in less than 2.5 microseconds. The SMP18's output swing includes the negative supply in both single and dual supply operation.
The SMP18 was specifically designed for systems that use a calibration cycle to adjust a multiple of system parameters. The low cost and high level of integration make the SMP18 ideal for calibration requirements that have previously required an ASIC, or high cost multiple D/A converters. The SMP18 is also ideally suited for a wide variety of sampleand- hold applications including amplifier offset or VCA gain adjustments. One or more SMP18s can be used with single or multiple DACs to provide multiple set points within a system.
The SMP18 offers significant cost and size reduction over discrete designs. It is available in a 16-pin plastic DIP, a
narrow body SO-16 surface-mount SOIC package or the thin TSSOP-16 package. The SMP18 is a higher speed direct
replacement for the SMP08.
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . ... . . . 0.3 V, 17 V
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V, 17 V
VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . .... . . . 0.3 V, VDD
VIN to DGND . . . . . . . . . . . . . . . . . . . . . .... . . . . . . . . VSS, VDD
VOUT to DGND . . . . . . . . . . . . . . . . . . . . ... . . . . . . . . VSS, VDD
Analog Output Current . . . . . . . . . . . . . .... . . . . . . . . . ±20 mA
(Not short-circuit protected)
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . 40 to +85
Junction Temperature . . . . . . . . . . . . ..... . . . . . . . . . . . +150
Storage Temperature . . . . . . . . . . . . . ... . . . . 65to +150
Lead Temperature (Soldering, 60 sec) . . . . . . .... . . . . . +300

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