SN54HC257, SN54HC257AJ, SN54HC257BCAJC Selling Leads, Datasheet
MFG:TI Package Cooled:CDIP D/C:93+
SN54HC257, SN54HC257AJ, SN54HC257BCAJC Datasheet download

Part Number: SN54HC257
MFG: TI
Package Cooled: CDIP
D/C: 93+
MFG:TI Package Cooled:CDIP D/C:93+
SN54HC257, SN54HC257AJ, SN54HC257BCAJC Datasheet download

MFG: TI
Package Cooled: CDIP
D/C: 93+
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Datasheet: SN54HC257
File Size: 271418 KB
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PDF/DataSheet Download
Datasheet: SN54/74LS00
File Size: 34868 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SN54/74LS00
File Size: 34868 KB
Manufacturer:
Download : Click here to Download
These devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized
systems. The 3-state outputs do not load the data lines when the output-enable (G) input is at a high logic level.
To ensure the high-impedance state during power up or power down, G should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, JA (see Note 1): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.

