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SN74LVT244, SN74LVT244ADB, SN74LVT244ADBR

SN74LVT244, SN74LVT244ADB, SN74LVT244ADBR Selling Leads, Datasheet

MFG:TI  Package Cooled:SOP  D/C:95

SN74LVT244, SN74LVT244ADB, SN74LVT244ADBR Picture

SN74LVT244, SN74LVT244ADB, SN74LVT244ADBR Datasheet download

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Part Number: SN74LVT244

 

MFG: TI

Package Cooled: SOP

D/C: 95

 

 

 
 
 
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  • SN74LVT244

  • Vendor: TI Pack: SOP D/C: 07+& Qty: 59 Note: new & original  Adddate: 2010-07-31
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  • KCENT(HK) ELECTRONICS CO.,LTD   China
    Contact: Ms.Sueki Chen   MSN:Meredith49@live.cn
    Tel: 86-0755-83014302
    Fax: 86-0755-83014780
    (562)
  • SN74LVT244A

  • Vendor: TI Pack: SOP/5.3 D/C: 93+& Qty: 76 Note: new and original part instock  Adddate: 2010-07-31
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  • Goldensand Electronic Co., Ltd   China
    Contact: Mr.sam   MSN:goldensand2@hotmail.com
    Tel: 86-0755-83372595
    Fax: 86-0755-83372186
    (622)

About SN74LVT244

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Datasheet: SN74LVT244

File Size: 112499 KB

Manufacturer: TI [Texas Instruments]

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SN74LVT244ADB Suppliers

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About SN7000

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Datasheet: SN7000

File Size: 81454 KB

Manufacturer: SIEMENS [Siemens Semiconductor Group]

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SN74LVT244ADBR Suppliers

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  • SN7000

  • Pack: CAN Qty: 560 Note: NEW IN STOCK  Adddate: 2010-07-31
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  • HY (HK) IC LIMITED   China
    Contact: Ms.Melody Chen/Julie Chen   MSN:julie_ic@hotmail.com
    Tel: 86-755-82535765
    Fax: 86-755-82535755
    (2370)

About SN7000

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Datasheet: SN7000

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Manufacturer: SIEMENS [Siemens Semiconductor Group]

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SN74LVT244 General Description

These octal buffers and line drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVT244 is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT244 is packaged in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT244 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74LVT244 is characterized for operation from –40°C to 85°C.

SN74LVT244 Maximum Ratings

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . –0.5 V to4.6 V
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . –0.5 V to 7 V
Voltage applied to any output in the high state or power-off state, VO (see Note 1). . –0.5 V to 7 V
Current into any output in the low state, IO: SN54LVT244 . . . . . . . . . . . .. . . . . . . . . . . . ..   . .96 mA 
                                                                       SN74LVT244 . . . . . . . . . . . . . . . . . . . . .  . . ..   .128 mA
Current into any output in the high state, IO (see Note 2): SN54LVT244 . . . . . . . . . .. . . . . . . .48 mA
                                                                                             SN74LVT244  . . . . . . . . .  . . . . .. . .64 mA

Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . .. .–50 mA
Output clamp current, IOK (VO < 0)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–50 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DB package  . . . .  . . . .  . . .0.6 W
                                                                                                         DW package  . . . .. . . . .  .. .1.6 W
                                                                                                         PW package  . . . . . . . . . . . .0.7 W
Storage temperature range  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .–65°C to 150°C
 

SN74LVT244 Features

• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
• Supports Live Insertion
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flatpacks (W), and Ceramic DIPS (J)

SN74LVT244 Connection Diagram

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