MFG:TOSHIBA Package Cooled: ? D/C:09+
TC7SB66FU SOT353-J9, TC7SB66FU(TE85L, TC7SBD384AFU Datasheet download
MFG: TOSHIBA
Package Cooled: ?
D/C: 09+
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PDF/DataSheet Download
Datasheet: TC70
File Size: 92092 KB
Manufacturer: TELCOM [TelCom Semiconductor, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TC70
File Size: 92092 KB
Manufacturer: TELCOM [TelCom Semiconductor, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TC70
File Size: 92092 KB
Manufacturer: TELCOM [TelCom Semiconductor, Inc]
Download : Click here to Download
The TC7SBD384AFU provides single bit of high-speed TTL-compatible switching. The low on resistance of the switch allows connections to be made with minimal propagation delay.
The device is organized as just 1-bit low-impedance switch with output-enable (OE) input. When OE is low, the switch is on and data can flow from port A to port B, or vice versa. When OE is high, the switch is open and a high-impedance state exists between the two ports.
The device is enable to realize the shift of signal level from 5 V to 3.3 V. All inputs are equipped with protection circuits against static discharge.
| SYMBOL | PARAMETER | RATING | UNIT |
| VCC | Power supply range | −0.5~7.0 | V |
| VIN | DC input voltage | −0.5~7.0 | V |
| VS | DC switch voltage | −0.5~7.0 | V |
| IIK | Input diode current | −50 | mA |
| IS | Continuous channel current | 128 | mA |
| PD | Power dissipation | 200 | mW |
| ICC/IGND | DC VCC/GND current | ±100 | mA |
| Tstg | Storage temperature | 65 to +150 |
Note: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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