TL7750ACDR, TL7752CR, TL7757 Selling Leads, Datasheet
MFG:TI Package Cooled:SOP-8 D/C:0440+
TL7750ACDR, TL7752CR, TL7757 Datasheet download
Part Number: TL7750ACDR
MFG: TI
Package Cooled: SOP-8
D/C: 0440+
TL7750ACDR, TL7752CR, TL7757
- Table of contents:
Info of TL7750ACDR
Info of TL7752CR
Info of TL7757
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About TL712
PDF/DataSheet Download
Datasheet: TL712
File Size: 82822 KB
Manufacturer: TI [Texas Instruments]
Download : Click here to Download
About TL712
PDF/DataSheet Download
Datasheet: TL712
File Size: 82822 KB
Manufacturer: TI [Texas Instruments]
Download : Click here to Download
About TL7757
PDF/DataSheet Download
Datasheet: TL7757
File Size: 165930 KB
Manufacturer: TI [Texas Instruments]
Download : Click here to Download
TL7757 General Description
The TL7757 is a supply-voltage supervisor designed for use in microcomputer and microprocessor systems. The supervisor monitors the supply voltage for undervoltage conditions. During power up, when the supply voltage, VCC, attains a value approaching 1 V, the RESET output becomes active (low) to prevent undefined operation. If the supply voltage drops below threshold voltage level (VIT), the RESET output goes to the active (low) level until the supply undervoltage fault condition is eliminated.
The TL7757C is characterized for operation from 0°C to 70°C. The TL7757I is characterized for operation from 40°C to 85°C.
TL7757 Maximum Ratings
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . .. . . 0.3 V to 20 V
Offstate output voltage range (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 20 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 mA
Package thermal impedance, JA (see Notes 2 and 3): D package . . . . . . . . . . . . . . .97°C/W
LP package . . . . . . . . . . . . .156°C/W
PK package . . . . . . . . . . . . . .52°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . .. . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P packages . . .260°C
Storage temperature range, Tstg. . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . 65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the network ground terminal.
2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150°C can impact reliability.
3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.
Offstate output voltage range (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 20 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 mA
Package thermal impedance, JA (see Notes 2 and 3): D package . . . . . . . . . . . . . . .97°C/W
LP package . . . . . . . . . . . . .156°C/W
PK package . . . . . . . . . . . . . .52°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . .. . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P packages . . .260°C
Storage temperature range, Tstg. . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . 65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the network ground terminal.
2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150°C can impact reliability.
3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.
TL7757 Connection Diagram
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