TLC2274, TLC22741, TLC2274AC Selling Leads, Datasheet
MFG:TI Package Cooled:SOP D/C:2007+
TLC2274, TLC22741, TLC2274AC Datasheet download

Part Number: TLC2274
MFG: TI
Package Cooled: SOP
D/C: 2007+
MFG:TI Package Cooled:SOP D/C:2007+
TLC2274, TLC22741, TLC2274AC Datasheet download

MFG: TI
Package Cooled: SOP
D/C: 2007+
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Datasheet: TLC2274A
File Size: 634429 KB
Manufacturer: TI [Texas Instruments]
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Datasheet: TLC04
File Size: 626839 KB
Manufacturer: TI [Texas Instruments]
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Datasheet: TLC2274ACD
File Size: 1374243 KB
Manufacturer: TI [Texas Instruments]
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The TLC2272 and TLC2274 are dual and quadruple operational amplifiers from Texas Instruments. Both devices exhibit rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLC227x family offers 2 MHz of bandwidth and 3 V/s of slew rate for higher speed applications.These devices offer comparable ac performance while having better noise, input offset voltage, and power dissipation than existing CMOS operational amplifiers. The TLC227x has a noise voltage of 9 nV/Hz, two times lower than competitive solutions.
The TLC227x, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature, with single- or split-supplies, makes this family a great choice when interfacing with analog-to-digital converters (ADCs). For precision applications, the TLC227xA family is available with a maximum input offset voltage of 950 V. This family is fully characterized at 5 V and ±5 V.
The TLC2272/4 also makes great upgrades to the TLC272/4 or TS272/4 in standard designs. They offer increased output dynamic range, lower noise voltage, and lower input offset voltage. This enhanced feature set allows them to be used in a wider range of applications. For applications that require higher output drive and wider input voltage range, see the TLV2432 and TLV2442 devices. If the design requires single amplifiers, see the TLV2211/21/31 family. These devices are single rail-to-rail operational amplifiers in the SOT-23 package. Their small size and low power consumption, make them ideal for high density, battery-powered equipment.
Supply voltage, VDD+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
Supply voltage, VDD− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . −8 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . ±16 V
Input voltage range, VI (any input, see Note 1) . . . VDD− − 0.3 V to VDD+
Input current, II (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±5 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Total current into VDD+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Total current out of VDD− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±50 mA
Duration of short-circuit current at (or below) 25 (see Note 3) . . unlimited
Package thermal impedance, JA (see Notes 4 and 5): D package (8 pin) . . .97.1/W
D package (14 pin) . . . . . . . . . . . . . . . . . . . 86.2/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . 79.7/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . 84.6/W
PW package (8 pin) . . . . . . . . . . . . . . . . . . . 149/W
PW package (14 pin) . . . . . . . . . . . . . . . . . . 113/W
Package thermal impedance, JC (see Notes 4 and 5): FK package . . . . 5.6/W
J package . . . . . . . . . . . . . . . . . . . . . . . . . . 15.1/W
U package . . . . . . . . . . . . . . . . . . . . . . . . . . 14.7/W
Operating free-air temperature range, TA: C suffix . . . . 0 to 70
I, Q suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .−40 to 125
M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55 to 125
Storage temperature range . . . . . . . . . . . . . . . . . . −65 to 150
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D, N, P or PW package . . 260
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: J or U package . . . . . . 300
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VDD+ and VDD −.
2. Differential voltages are at IN+ with respect to IN −. Excessive current will flow if input is brought below VDD− − 0.3 V.
3. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation rating is not exceeded.
4. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/JA. Operating at the absolute maximum TJ of 150 can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7 (plastic) or MIL-STD-883 Method 1012 (ceramic).

