TLP3012GB, TLP3020, TLP3021 Selling Leads, Datasheet
MFG:1000 Package Cooled:05+ D/C:08+09+
TLP3012GB, TLP3020, TLP3021 Datasheet download
Part Number: TLP3012GB
MFG: 1000
Package Cooled: 05+
D/C: 08+09+
MFG:1000 Package Cooled:05+ D/C:08+09+
TLP3012GB, TLP3020, TLP3021 Datasheet download
MFG: 1000
Package Cooled: 05+
D/C: 08+09+
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PDF/DataSheet Download
Datasheet: TLP
File Size: 345950 KB
Manufacturer: STMicroelectronics
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLP3020
File Size: 189065 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLP3021
File Size: 189065 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
The TOSHIBA TLP3020, TLP3021, TLP3022 and TLP3023 consist of a photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP package.
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | ||
LED |
Forward Current |
IF |
50 |
mA | |
Forward Current Derating (Ta 53) |
IF/ |
−0.7 |
mA/ | ||
Peak Forward Current (100s pulse, 100pps) |
IFP |
1 |
A | ||
Power Dissipation |
PD |
100 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−1.0 |
mW/ | ||
Reverse Voltage |
VR |
5 |
V | ||
Junction Temperature |
Tj |
125 |
|||
DETECTOR |
Off-State Output Terminal Voltage |
VDRM |
400 |
V | |
On-Stage RMS | Ta=25 |
IT(RMS) |
100 |
mA | |
Current | Ta=70 |
50 | |||
On-State Current Derating (Ta 25) |
IT/ |
−1.1 |
mA/ | ||
Peak On-Stage Current (100s pulse, 120pps) |
ITP |
2 |
A | ||
Peak Nonrepetitive Surge Current (PW=10ms, DC=10%) |
ITSM |
1.2 |
A | ||
Power Dissipation |
PD |
300 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−4.0 |
mW/ | ||
Junction Temperature |
Tj |
115 |
|||
Storage Temperature Range |
Tstg |
−55 ~ 150 |
|||
Operating Temperature Range |
Topr |
−40 ~ 100 |
|||
Lead Soldering Temperature (10s) |
Tsol |
260 |
|||
Total Package Power Dissipation |
PT |
330 |
mW | ||
Total Package Power Dissipation Derating (Ta 25) |
PT/ |
−4.4 |
mW/ | ||
Isolation Voltage (AC, 1 min., R.H. 60%) (Note 1) |
BVS |
5000 |
Vrms |
Note 1: Device considered a two terminal device :Pins 1, 2 and 3 shorted together and pins 4 and 6 shorted together.
Peak Off-State Voltage : 400 V (Min.)
Trigger LED Current : 30mA (Max.) (TLP3020)
15 mA (Max.) (TLP3021)
10 mA (Max.) (TLP3022)
5 mA (Max.) (TLP3023)
On-State Current : 100 mA (Max.)
UL Recognized : UL1577, File No. E67349
Isolation Voltage : 5000 Vrms (Min.)
Option (D4) Type
VDE Approved : DIN VDE0884 / 08.87,
Certificate No. 68329
Maximum Operating Insulation Voltage: 630 VPK
Highest Permissible Over Voltage: 6000 VPK
Note: When a VDE0884 approved type is needed, please designate the " Option (D4) "
7.62mm pich 10.16 mm pich
standard type (LF2) type
Creepage Distance : 7.0 mm (Min.) 8.0 mm (Min.)
Clearance : 7.0 mm (Min.) 8.0 mm (Min.)
Insulation Thickness : 0.5 mm (Min.) 0.5 mm (Min.)
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | ||
LED |
Forward Current |
IF |
50 |
mA | |
Forward Current Derating (Ta 53) |
IF/ |
−0.7 |
mA/ | ||
Peak Forward Current (100s pulse, 100pps) |
IFP |
1 |
A | ||
Power Dissipation |
PD |
100 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−1.0 |
mW/ | ||
Reverse Voltage |
VR |
5 |
V | ||
Junction Temperature |
Tj |
125 |
|||
DETECTOR |
Off-State Output Terminal Voltage |
VDRM |
400 |
V | |
On-Stage RMS | Ta=25 |
IT(RMS) |
100 |
mA | |
Current | Ta=70 |
50 | |||
On-State Current Derating (Ta 25) |
IT/ |
−1.1 |
mA/ | ||
Peak On-Stage Current (100s pulse, 120pps) |
ITP |
2 |
A | ||
Peak Nonrepetitive Surge Current (PW=10ms, DC=10%) |
ITSM |
1.2 |
A | ||
Power Dissipation |
PD |
300 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−4.0 |
mW/ | ||
Junction Temperature |
Tj |
115 |
|||
Storage Temperature Range |
Tstg |
−55 ~ 150 |
|||
Operating Temperature Range |
Topr |
−40 ~ 100 |
|||
Lead Soldering Temperature (10s) |
Tsol |
260 |
|||
Total Package Power Dissipation |
PT |
330 |
mW | ||
Total Package Power Dissipation Derating (Ta 25) |
PT/ |
−4.4 |
mW/ | ||
Isolation Voltage (AC, 1 min., R.H. 60%) (Note 1) |
BVS |
5000 |
Vrms |
The TOSHIBA TLP3020, TLP3021, TLP3022 and TLP3023 consist of a photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP package.
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | ||
LED |
Forward Current |
IF |
50 |
mA | |
Forward Current Derating (Ta 53) |
IF/ |
−0.7 |
mA/ | ||
Peak Forward Current (100s pulse, 100pps) |
IFP |
1 |
A | ||
Power Dissipation |
PD |
100 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−1.0 |
mW/ | ||
Reverse Voltage |
VR |
5 |
V | ||
Junction Temperature |
Tj |
125 |
|||
DETECTOR |
Off-State Output Terminal Voltage |
VDRM |
400 |
V | |
On-Stage RMS | Ta=25 |
IT(RMS) |
100 |
mA | |
Current | Ta=70 |
50 | |||
On-State Current Derating (Ta 25) |
IT/ |
−1.1 |
mA/ | ||
Peak On-Stage Current (100s pulse, 120pps) |
ITP |
2 |
A | ||
Peak Nonrepetitive Surge Current (PW=10ms, DC=10%) |
ITSM |
1.2 |
A | ||
Power Dissipation |
PD |
300 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−4.0 |
mW/ | ||
Junction Temperature |
Tj |
115 |
|||
Storage Temperature Range |
Tstg |
−55 ~ 150 |
|||
Operating Temperature Range |
Topr |
−40 ~ 100 |
|||
Lead Soldering Temperature (10s) |
Tsol |
260 |
|||
Total Package Power Dissipation |
PT |
330 |
mW | ||
Total Package Power Dissipation Derating (Ta 25) |
PT/ |
−4.4 |
mW/ | ||
Isolation Voltage (AC, 1 min., R.H. 60%) (Note 1) |
BVS |
5000 |
Vrms |
Note 1: Device considered a two terminal device :Pins 1, 2 and 3 shorted together and pins 4 and 6 shorted together.
Peak Off-State Voltage : 400 V (Min.)
Trigger LED Current : 30mA (Max.) (TLP3020)
15 mA (Max.) (TLP3021)
10 mA (Max.) (TLP3022)
5 mA (Max.) (TLP3023)
On-State Current : 100 mA (Max.)
UL Recognized : UL1577, File No. E67349
Isolation Voltage : 5000 Vrms (Min.)
Option (D4) Type
VDE Approved : DIN VDE0884 / 08.87,
Certificate No. 68329
Maximum Operating Insulation Voltage: 630 VPK
Highest Permissible Over Voltage: 6000 VPK
Note: When a VDE0884 approved type is needed, please designate the " Option (D4) "
7.62mm pich 10.16 mm pich
standard type (LF2) type
Creepage Distance : 7.0 mm (Min.) 8.0 mm (Min.)
Clearance : 7.0 mm (Min.) 8.0 mm (Min.)
Insulation Thickness : 0.5 mm (Min.) 0.5 mm (Min.)
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | ||
LED |
Forward Current |
IF |
50 |
mA | |
Forward Current Derating (Ta 53) |
IF/ |
−0.7 |
mA/ | ||
Peak Forward Current (100s pulse, 100pps) |
IFP |
1 |
A | ||
Power Dissipation |
PD |
100 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−1.0 |
mW/ | ||
Reverse Voltage |
VR |
5 |
V | ||
Junction Temperature |
Tj |
125 |
|||
DETECTOR |
Off-State Output Terminal Voltage |
VDRM |
400 |
V | |
On-Stage RMS | Ta=25 |
IT(RMS) |
100 |
mA | |
Current | Ta=70 |
50 | |||
On-State Current Derating (Ta 25) |
IT/ |
−1.1 |
mA/ | ||
Peak On-Stage Current (100s pulse, 120pps) |
ITP |
2 |
A | ||
Peak Nonrepetitive Surge Current (PW=10ms, DC=10%) |
ITSM |
1.2 |
A | ||
Power Dissipation |
PD |
300 |
mW | ||
Power Dissipation Derating (Ta 25) |
PD/ |
−4.0 |
mW/ | ||
Junction Temperature |
Tj |
115 |
|||
Storage Temperature Range |
Tstg |
−55 ~ 150 |
|||
Operating Temperature Range |
Topr |
−40 ~ 100 |
|||
Lead Soldering Temperature (10s) |
Tsol |
260 |
|||
Total Package Power Dissipation |
PT |
330 |
mW | ||
Total Package Power Dissipation Derating (Ta 25) |
PT/ |
−4.4 |
mW/ | ||
Isolation Voltage (AC, 1 min., R.H. 60%) (Note 1) |
BVS |
5000 |
Vrms |