TLP321(GB), TLP3213, TLP3214 Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:DIP D/C:7415
TLP321(GB), TLP3213, TLP3214 Datasheet download
Part Number: TLP321(GB)
MFG: TOSHIBA
Package Cooled: DIP
D/C: 7415
MFG:TOSHIBA Package Cooled:DIP D/C:7415
TLP321(GB), TLP3213, TLP3214 Datasheet download
MFG: TOSHIBA
Package Cooled: DIP
D/C: 7415
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PDF/DataSheet Download
Datasheet: TLP
File Size: 345950 KB
Manufacturer: STMicroelectronics
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLP
File Size: 345950 KB
Manufacturer: STMicroelectronics
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLP
File Size: 345950 KB
Manufacturer: STMicroelectronics
Download : Click here to Download
The TOSHIBA TLP3213 is a super small-outline photorelay, suitable for surface-mount assembly. The TLP3213 consists of a GaAs infrared-emitting diode optically coupled to a photo-MOS FET and housed in a 4-pin package.
Its characteristics include low OFF-state current and low output pin capacitance, enabling it to be used in high-frequency measuring instruments.
Characteristic |
Symbol |
Rating |
Unit |
Forward current |
IF |
50 |
mA |
Forward current derating (Ta25) |
IF / |
-0.5 |
mA / |
Reverse Voltage |
VR |
5 |
V |
Junction Temperature |
Tj |
125 |
|
Off-State Output Terminal Voltage |
VOFF |
40 |
V |
On-State Current |
ION |
250 |
mA |
On-State Current Derating (Ta 25) |
ION/ |
-2.5 |
mA / |
Junction Temperature |
Tj |
125 |
|
Storage Temperature Range |
Tstg |
−40~125 |
|
Operating temperature range |
Topr |
-20~85 |
|
Lead Soldering Temperature (10 s) |
Tsol |
260 |
|
Isolation Voltage (AC, 1 minute, R.H. 60%) (NOTE1) |
BVS |
1500 |
Vrms |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
(NOTE1) : Device considered a two-terminal device : Pins 1 and, 2 shorted together, and pins 3 and 4 shorted together.
The TOSHIBA TLP3214 is a super small-outline photorelay, suitable for surface-mount assembly. The TLP3214 consists of a GaAs infrared-emitting diode optically coupled to a photo-MOS FET and housed in a 4-pin package.
Its characteristics include low OFF-state current and low output pin capacitance, enabling it to be used in high-frequency measuring instruments.
Characteristic |
Symbol |
Rating |
Unit |
Forward current |
IF |
50 |
mA |
Forward current derating (Ta25°C) |
IF / |
-0.5 |
mA / |
Reverse Voltage |
VR |
5 |
V |
Junction Temperature |
Tj |
125 |
|
Off-State Output Terminal Voltage |
VOFF |
40 |
V |
On-State Current |
ION |
250 |
mA |
On-State Current Derating (Ta 25°C) |
ION/ |
-2.5 |
mA / |
Junction Temperature |
Tj |
125 |
|
Storage Temperature Range |
Tstg |
−40~125 |
|
Operating temperature range |
Topr |
-20~85 |
|
Lead Soldering Temperature (10 s) |
Tsol |
260 |
|
Isolation Voltage (AC, 1 minute, R.H. 60%) (NOTE1) |
BVS |
1500 |
Vrms |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
(NOTE 1) : Device considered a two-terminal device : Pins 1 and, 2 shorted together, and pins 3 and 4 shorted together.