TLP832-F (PB), TLP832-F(PB), TLP833 Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:DIP D/C:05+
TLP832-F (PB), TLP832-F(PB), TLP833 Datasheet download
Part Number: TLP832-F (PB)
MFG: TOSHIBA
Package Cooled: DIP
D/C: 05+
TLP832-F (PB), TLP832-F(PB), TLP833
- Table of contents:
Info of TLP832-F (PB)
Info of TLP832-F(PB)
Info of TLP833
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About TLP
PDF/DataSheet Download
Datasheet: TLP
File Size: 345950 KB
Manufacturer: STMicroelectronics
Download : Click here to Download
About TLP
PDF/DataSheet Download
Datasheet: TLP
File Size: 345950 KB
Manufacturer: STMicroelectronics
Download : Click here to Download
About TLP
PDF/DataSheet Download
Datasheet: TLP
File Size: 345950 KB
Manufacturer: STMicroelectronics
Download : Click here to Download
TLP833 General Description
The TLP833(F) is a photointerrupter which incorporates a high radiant power GaAs LED and a fastresponse Si phototransistor. The package has a deep gap.
TLP833 Maximum Ratings
|
VCharacteristic |
Symbol |
Rating |
Unit | |
| LED | Forward current Forward current derating 25< Ta85 (Ta>85) Reverse voltage |
IF IF/ IF/ VR |
50 -0.33 -2 5 |
mA |
| Detector | Collectoremitter voltage Emittercollector voltage Collector power dissipation CollectorPower dissipation derating (Ta>25) |
VCEO VECO PC PC/ |
35 5 75 -1 |
V V mW mA/ |
| Collector current |
IC |
50 |
mA | |
| Operating temperature range |
Topr |
-30~85 |
||
| Storage temperature range |
Tstg |
-40~100 |
||
| Soldering temperature (5 s) |
Tsol |
260 |
||
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
TLP833 Features
`Package with deep gap (gap: 12 mm)
`Designed for direct mounting on printed circuit boards (positioning pins included).
`Gap: 5mm
`Resolution: Slit width 0.5mm
`High current transfer ratio: IC/IF = 5% (min)
`High temperature operation: Topr = 95 (max)
`Package material: Polybutylene terephthalate (UL94-V-0)
`Detector impermeable to visible light
`Designed for direct mounting on printed circuit boards (positioning pins included).
`Gap: 5mm
`Resolution: Slit width 0.5mm
`High current transfer ratio: IC/IF = 5% (min)
`High temperature operation: Topr = 95 (max)
`Package material: Polybutylene terephthalate (UL94-V-0)
`Detector impermeable to visible light
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