TPCA8102-TE12LQ, TPCA8103A, TPCF8104 Selling Leads, Datasheet
MFG:TOS Package Cooled:TOS D/C:04+
TPCA8102-TE12LQ, TPCA8103A, TPCF8104 Datasheet download
Part Number: TPCA8102-TE12LQ
MFG: TOS
Package Cooled: TOS
D/C: 04+
MFG:TOS Package Cooled:TOS D/C:04+
TPCA8102-TE12LQ, TPCA8103A, TPCF8104 Datasheet download
MFG: TOS
Package Cooled: TOS
D/C: 04+
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PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPCF8104
File Size: 84133 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
Characteristics |
Symbol |
Rating |
Unit | |
Drain-source voltage |
VDSS |
−30 |
V | |
Drain?gate voltage (RGS = 20 k) |
VDGR |
−30 |
V | |
Gate?source voltage |
VGSS |
±20 |
V | |
Drain current | DC (Note 1) |
ID |
−6 |
A
|
Pulse (Note 1) |
IDP |
−24 | ||
Drain power dissipation (t = 5 s) (Note 2a) |
PD |
2.5 |
W | |
Drain power dissipation (t = 5 s) (Note 2b) |
PD |
0.7 | ||
Single pulse avalanche energy (Note 3) |
EAS |
5.8 |
mJ | |
Avalanche current |
IAR |
−3 |
A | |
Repetitive avalanche energy (Note 4) |
EAR |
0.25 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
TSTG |
-55 ~ 150 |
Note: (Note 1), (Note 2), (Note 3), (Note 4) and (Note 5): See the next page.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling recautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).