TPCP8701, TPCP8901, TPCP8L01 Selling Leads, Datasheet
MFG:TOS Package Cooled:SOP8 D/C:2008
TPCP8701, TPCP8901, TPCP8L01 Datasheet download

Part Number: TPCP8701
MFG: TOS
Package Cooled: SOP8
D/C: 2008
MFG:TOS Package Cooled:SOP8 D/C:2008
TPCP8701, TPCP8901, TPCP8L01 Datasheet download

MFG: TOS
Package Cooled: SOP8
D/C: 2008
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPC-02026
File Size: 454219 KB
Manufacturer: MICRO-ELECTRONICS [Micro Electronics]
Download : Click here to Download
|
Characteristics |
Symbol |
Rating |
Unit | ||
|
PNP |
NPN | ||||
| Collector-base voltage |
VCBO |
-50 |
100 |
V | |
| Collector-emitter voltage |
VCEO |
-50 |
50 |
V | |
| Emitter-base voltage |
VEBO |
-7 |
7 |
V | |
| Collector current | DC(Note 1) |
IC |
-0.8 |
1.0 |
A |
| Pulse(Note 1 ) |
ICP |
-5.0 |
5.0 |
A | |
| Base current |
IB |
-100 |
100 |
mA | |
| Collector power dissipation (t = 10s) |
Single-device operation |
PC(Note2) |
1.48 |
W | |
| Single-device value at dual operation |
0.80 | ||||
| Collector power dissipation (DC) |
Single-device operation |
PC(Note2) |
0.83 |
W | |
| Single-device value at dual operation |
0.48 | ||||
| Junction temperature |
Tj |
150 |
|||
| Storage temperature range |
Tstg |
−55 to 150 |
|||
Note 1: Please use devices on condition that the junction temperature is below 150.Icp=±5A (@ t100s)
Note 2: Mounted on FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)
Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
