TSM2302CXRF, TSM2312, TSM28S-28D Selling Leads, Datasheet
MFG:ROC Package Cooled:SOT-23 D/C:09+
TSM2302CXRF, TSM2312, TSM28S-28D Datasheet download
Part Number: TSM2302CXRF
MFG: ROC
Package Cooled: SOT-23
D/C: 09+
TSM2302CXRF, TSM2312, TSM28S-28D
- Table of contents:
Info of TSM2302CXRF
Info of TSM2312
Info of TSM28S-28D
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About TSM
PDF/DataSheet Download
Datasheet: TSM
File Size: 678072 KB
Manufacturer:
Download : Click here to Download
About TSM2312
PDF/DataSheet Download
Datasheet: TSM2312
File Size: 168420 KB
Manufacturer: TSC [Taiwan Semiconductor Company, Ltd]
Download : Click here to Download
About TSM
PDF/DataSheet Download
Datasheet: TSM
File Size: 678072 KB
Manufacturer:
Download : Click here to Download
TSM2312 Maximum Ratings
|
Parameter |
Symbol |
Limit |
Unit | |
|
Drain-Source Voltage |
VDS |
20V |
V | |
|
Gate-Source Voltage |
VGS |
±8 |
V | |
|
Continuous Drain Current |
ID |
5 |
A | |
|
Pulsed Drain Current |
IDM |
15 |
A | |
|
Maximum Power Dissipation |
Ta = 25 |
PD |
1.25 |
W |
|
Ta = 75 |
0.8 | |||
|
Operating Junction Temperature |
TJ |
+150 |
||
|
Operating Junction and Storage Temperature Range |
TJ, TSTG |
- 55 to +150 |
||
TSM2312 Features
Advanced trench process technology
High density cell design for ultra low on-resistance
Excellent thermal and electrical capabilities
Compact and low profile SOT-23 package
High density cell design for ultra low on-resistance
Excellent thermal and electrical capabilities
Compact and low profile SOT-23 package
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