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28F400B1, 28F400B1-8, 28F400B3

28F400B1, 28F400B1-8, 28F400B3 Selling Leads, Datasheet

MFG:KA/SOP  Package Cooled:TSSOP  D/C:1998

28F400B1, 28F400B1-8, 28F400B3 Picture

28F400B1, 28F400B1-8, 28F400B3 Datasheet download

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Part Number: 28F400B1

 

MFG: KA/SOP

Package Cooled: TSSOP

D/C: 1998

 

 

 
 
 
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  • 28F004B5

  • Vendor: MT Pack: IC Qty: 224  Adddate: 2019-09-16
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  • A_COMTECH TECHNOLOGY LTDA   Brazil
    Contact: Mr.LuizCamargo   MSN:A_comtech@hotmail.com
    Tel: 055-41-3347-2774
    Fax: 055-41-3248-2879
    (616)
  • 28F010

  • Vendor: CSI Pack: DIP Qty: 5000 Note: 3-4 Days  Adddate: 2019-09-16
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  • Hongkong Uptrend Technology   China
    Contact: Ms.LinLisa   MSN:kenny_ic@hotmail.com
    Tel: 86-755-22205904
    Fax: 86-755-22205804
    (5)

About 28F001BX

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Datasheet: 28F001BX

File Size: 663587 KB

Manufacturer: Intel

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  • 28F004B5

  • Vendor: MT Pack: IC Qty: 224  Adddate: 2019-09-16
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  • A_COMTECH TECHNOLOGY LTDA   Brazil
    Contact: Mr.LuizCamargo   MSN:A_comtech@hotmail.com
    Tel: 055-41-3347-2774
    Fax: 055-41-3248-2879
    (616)
  • 28F010

  • Vendor: CSI Pack: DIP Qty: 5000 Note: 3-4 Days  Adddate: 2019-09-16
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  • Hongkong Uptrend Technology   China
    Contact: Ms.LinLisa   MSN:kenny_ic@hotmail.com
    Tel: 86-755-22205904
    Fax: 86-755-22205804
    (5)

About 28F001BX

PDF/DataSheet Download

Datasheet: 28F001BX

File Size: 663587 KB

Manufacturer: Intel

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28F400B3 Suppliers

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  • 28F004B5

  • Vendor: MT Pack: IC Qty: 224  Adddate: 2019-09-16
  • Inquire Now
  • A_COMTECH TECHNOLOGY LTDA   Brazil
    Contact: Mr.LuizCamargo   MSN:A_comtech@hotmail.com
    Tel: 055-41-3347-2774
    Fax: 055-41-3248-2879
    (616)
  • 28F010

  • Vendor: CSI Pack: DIP Qty: 5000 Note: 3-4 Days  Adddate: 2019-09-16
  • Inquire Now
  • Hongkong Uptrend Technology   China
    Contact: Ms.LinLisa   MSN:kenny_ic@hotmail.com
    Tel: 86-755-22205904
    Fax: 86-755-22205804
    (5)

About 28F400B3

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Datasheet: 28F400B3

File Size: 311549 KB

Manufacturer: INTEL [Intel Corporation]

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28F400B3 General Description

The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective, monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.

28F400B3 Maximum Ratings

Extended Operating Temperature
     During Read .......................... –40 °C to +85 °C
     During Block Erase
     and Program.......................... –40 °C to +85 °C
     Temperature Under Bias ....... –40 °C to +85 °C
Storage Temperature................. –65 °C to +125 °C
Voltage on Any Pin
     (except VCC, VCCQ and VPP)
     with Respect to GND............. –0.5 V to 3.7 V(1)
VPP Voltage (for Block
     Erase and Program)
     with Respect to GND.....–0.5 V to +13.5 V(1,2,4)
VCC and VCCQ Supply Voltage
     with Respect to GND........... –0.2 V to +3.7 V(5)
Output Short Circuit Current.....................100 mA(3)

28F400B3 Features

■ Flexible SmartVoltage Technology
 -2.7 V–3.6 V Read/Program/Erase
 -12 V VPP Fast Production Programming
2.7 V or 1.65 V I/O Option
 -Reduces Overall System Power
High Performance
 -2.7 V–3.6 V: 90 ns Max Access Time
 -3.0 V–3.6 V: 80 ns Max Access Time
Optimized Block Sizes
 -Eight 8-KB Blocks for Data,Top or Bottom Locations
 -Up to Sixty-Three 64-KB Blocks for Code
Block Locking
 -VCC-Level Control through WP#
Low Power Consumption
 -10 mA Typical Read Current
Absolute Hardware-Protection
 -VPP = GND Option
 -VCC Lockout Voltage
Extended Temperature Operation
 -–40 °C to +85 °C
Flash Data Integrator Software
 -Flash Memory Manager
 -System Interrupt Manager
 -Supports Parameter Storage, Streaming Data (e.g., Voice)
Automated Program and Block Erase
 -Status Registers
Extended Cycling Capability
 -Minimum 100,000 Block Erase Cycles Guaranteed
Automatic Power Savings Feature
 -Typical ICCS after Bus Inactivity
Standard Surface Mount Packaging
 -48-Ball µBGA* Package
 -48-Lead TSOP Package
 -40-Lead TSOP Package
Footprint Upgradeable
 -Upgrade Path for 4-, 8-, 16-, and 32-Mbit Densities
ETOX™ VI (0.25 µ) Flash Technology

28F400B3 Connection Diagram

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