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646729-1, 646759-1, 6468

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Info of 646729-1
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Info of 6468

646729-1, 646759-1, 6468 Selling Leads, Datasheet

MFG:TYCO Package Cooled:N/A D/C:0836

646729-1, 646759-1, 6468 Datasheet download

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Part Number: 646729-1

MFG: TYCO

Package Cooled: N/A

D/C: 0836

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6468 General Description

The LMD18200 is a 3A H-Bridge designed for motion control applications. The device is built using a multi-technology process which combines bipolar and CMOS control circuitry with DMOS power devices on the same monolithic structure. Ideal for driving DC and stepper motors; the LMD18200 accommodates peak output currents up to 6A. An innovative circuit which facilitates low-loss sensing of the output current has been implemented.

6468 Maximum Ratings

Total Supply Voltage at Vs Pin
Vs, Pins 6 & 7                                                                       60V
Voltage at Pins
Pins 3, 4, 5, 9, 10, 15, 16, 17, 21 & 22                                 12V
Voltage at Bootstrap Pins
Pins 1, 12, 13, & 24 Vout                                                      + 16V
Peak Output Current (200ms)
                                                                                             6A
Continuous Output Current
(Note 4)
                                                                                             3A
Power Dissipation
(Note 2, 3)
                                                                                             25W
Power Dissipation (Ta = 25 C, Free Air)
                                                                                             3W
Junction Temperature, Tj(max)
                                                                                             150 C
Thermal Resistance
ThetaJA
(Still Air)                                                                                40.5 C/W
(500LF/Min Air flow)                                                               13 C/W
ThetaJC                                                                                1.4 C/W
(Note 3)
ESD Susceptibility
(Note 5)
                                                                                              1500V
Storage Temperature, Tstg
                                                                                              -65 C to +150 C
Lead Temperature (Soldering, 10 Sec.)
                                                                                              300 C
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower.

Note 3: The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the pacakge, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal reisstance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.

Note 4: See Application Information for details regarding current limiting.

Note 5: Human-body model, 100pF discharged through a 1.5K Ohm resistor. Except Bootstrap pins (pins 1, 12, 13, and 24) which are protected to 1000V of ESD.

6468 Features

- Delivers up to 3A continuous output
- Operates at supply voltages up to 55V
- Low Rds(ON) typically 0.3 Ohms per switch
- TTL and CMOS compatible inputs
- No "shoot-through" current
- Thermal warning flag output at 145 C
- Thermal shutdown (outputs off) at 170 C
- Internal clamp diodes
- Shorted load protection
- Internal charge pump with external bootstrap capability
- CONTROLLING DOCUMENTS:
LMD18200-2D-QV 5962-9232501VXA
LMD18200-2D/883 5962-9232501MXA

6468 Typical Application

- DC and stepper motor drives
- Position and velocity servomechanisms
- Factory automation robots
- Numerically controlled machinery
- Computer printers and plotters

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