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AM1214-100, AM1214-200, AM1214-300

AM1214-100, AM1214-200, AM1214-300 Selling Leads, Datasheet

MFG:ASI  D/C:07+

AM1214-100, AM1214-200, AM1214-300 Picture

AM1214-100, AM1214-200, AM1214-300 Datasheet download

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Part Number: AM1214-100

 

MFG: ASI

Package Cooled:

D/C: 07+

 

 

 
 
 
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  • AM100YXF331MEFC

  • Vendor: RUBYCON Qty: 1235  Adddate: 2024-05-07
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  • weiming   China
    Contact: Mr.zhang   MSN:zhangwm1986@hotmail.com
    Tel: 0086-0755-82766465
    Fax: 0086-0755-82766465
    (1)
  • AM10470SADC

  • Vendor: AMD D/C: 98+& Qty: 52 Note: oem xs,2-3days  Adddate: 2024-05-07
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  • Skyeast Intl. Ltd.   China
    Contact: Mr.RichardLiu  
    Tel: 86--755-83276226
    Fax: 86--755--83215205
    (0)

About AM1214-100

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Datasheet: AM1214-100

File Size: 35929 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

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AM1214-200 Suppliers

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  • AM100YXF331MEFC

  • Vendor: RUBYCON Qty: 1235  Adddate: 2024-05-07
  • Inquire Now
  • weiming   China
    Contact: Mr.zhang   MSN:zhangwm1986@hotmail.com
    Tel: 0086-0755-82766465
    Fax: 0086-0755-82766465
    (1)
  • AM10470SADC

  • Vendor: AMD D/C: 98+& Qty: 52 Note: oem xs,2-3days  Adddate: 2024-05-07
  • Inquire Now
  • Skyeast Intl. Ltd.   China
    Contact: Mr.RichardLiu  
    Tel: 86--755-83276226
    Fax: 86--755--83215205
    (0)

About AM1214-200

PDF/DataSheet Download

Datasheet: AM1214-200

File Size: 58913 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

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AM1214-300 Suppliers

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  • AM100YXF331MEFC

  • Vendor: RUBYCON Qty: 1235  Adddate: 2024-05-07
  • Inquire Now
  • weiming   China
    Contact: Mr.zhang   MSN:zhangwm1986@hotmail.com
    Tel: 0086-0755-82766465
    Fax: 0086-0755-82766465
    (1)
  • AM10470SADC

  • Vendor: AMD D/C: 98+& Qty: 52 Note: oem xs,2-3days  Adddate: 2024-05-07
  • Inquire Now
  • Skyeast Intl. Ltd.   China
    Contact: Mr.RichardLiu  
    Tel: 86--755-83276226
    Fax: 86--755--83215205
    (0)

About AM1214-300

PDF/DataSheet Download

Datasheet: AM1214-300

File Size: 94353 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Download : Click here to Download

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AM1214-100 General Description

The AM1214-100 device is a high power Class C transistor specifically designed for L-Band Radar pulsed driver applications.

This device is capable of operation over a wide range of pulse widths, duty cycles, and temperatures and is capable of withstanding 3:1 output VSWR at rated RF conditions. Low RF thermal resistance and computerized automatic wire bonding techniques ensure high reliability and product consistency.

AM1214-100 is supplied in the grounded IMPAC™ hermetic metal/ceramic package with internal input/output matching structures.

AM1214-100 Maximum Ratings

Symbol Parameter Value Unit
PDISS Power Dissipation* (TC  100°C) 270 W
IC Device Current* 13.5 A
VCC Collector-Supply Voltage* 32 V
TJ Junction Temperature (Pulsed RF Operation) 250 °C
TSTG Storage Temperature - 65 to +200 °C

AM1214-200 General Description

The AM1214-200 device is a high power Class C transistor specifically designed for L-Band Radar pulsed output and driver applications.

This device is capable of operation over a wide range of pulse widths, duty cycles and temperatures, and wiil tolerate severe mismatch and overdrive conditions. Low RF thermal resistance and computerized automatic wire bonding techniques ensure high reliability and product consistency.

AM1214-200 is supplied in the BIGPAC] hermetic metal/ceramic package with internal input/output matching structures.

AM1214-200 Maximum Ratings

Symbol Parameter Value Unit
PDISS Power Dissipation* (TC  100°C) 575 W
IC Device Current* 16 A
VCC Collector-Supply Voltage* 40 V
TJ Junction Temperature (Pulsed RF Operation) 250 °C
TSTG Storage Temperature - 65 to +200 °C

AM1214-300 General Description

The AM1214-300 device is a high power transistor specifically designed for L-Band radar pulsed output and driver applications.

This device is designed for operation under moderate pulse width and duty cycle pulse conditions and is capable of withstanding 5:1 output VSWR at rated RF conditions. Low RF thermal resistance and computerized automatic wire bonding techniques ensure high reliability and product consistency.

The AM1214-300 is supplied in the BIGPAC] Hermetic Metal/Ceramic package with internal Input/Output matching structures.

AM1214-300 Maximum Ratings

Symbol Parameter Value Unit
PDISS Power Dissipation* (TC  100°C) 730 W
IC Device Current* 18.75 A
VCC Collector-Supply Voltage* 55 V
TJ Junction Temperature (Pulsed RF Operation) 250 °C
TSTG Storage Temperature - 65 to +200 °C

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